Digitally-Driven Hybrid Manufacture of Ceramic Thick-Film Substrates

J. Hinton, M. Mirgkizoudi, A. Campos-Zatarain, David Flynn, R. A. Harris, R. W. Kay

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Ceramic substrates are commonly used in the electronics industry across a range of applications such as automotive, aerospace, industrial monitoring, power electronics and electromagnetic devices due to their ability to withstand high temperatures, pressures, radiation and mechanical shock. This paper will present the development of a new digitally-driven hybrid manufacturing process which overcomes many of the current limitations of stand-alone Additive Manufacturing for the production of precision engineered ceramic substrates and packages. This is achieved by interleaving ceramic paste extrusion with sacrificial support printing and micro-machining to produce a three-dimensional ceramic green-state part. A number of substrates were fabricated using a high viscosity, non-Newtonian paste consisting of 96wt% alumina. Thermally processing the substrate at temperatures in excess of 1400 °C yields a monolithic ceramic substrate with resultant shrinkages of ∼18% and part densities of ∼99.8%. The 3D ceramic part is then processed using computer-controlled equipment to selectively dispense a conformal circuit using silver thick film conductor paste, followed by solder dispensing and pick and place surface mount assembly of components. This fully digitally driven approach enables new design freedoms and customization currently not possible with conventional template driven manufacturing methods of ceramic electronic packages.

Original languageEnglish
Title of host publication2018 7th Electronic System-Integration Technology Conference (ESTC)
PublisherIEEE
ISBN (Electronic)9781538668146
DOIs
Publication statusPublished - 29 Nov 2018
Event7th Electronic System-Integration Technology Conference 2018 - Dresden, Germany
Duration: 18 Sep 201821 Sep 2018

Conference

Conference7th Electronic System-Integration Technology Conference 2018
Abbreviated titleESTC 2018
CountryGermany
CityDresden
Period18/09/1821/09/18

Fingerprint

Thick films
Ointments
Substrates
3D printers
Aluminum Oxide
Electronics industry
Power electronics
Silver
Soldering alloys
Extrusion
Printing
Machining
Alumina
Viscosity
Radiation
Temperature
Networks (circuits)
Monitoring
Processing

Keywords

  • Additive Manufacturing
  • Ceramic
  • Electronic Substrates
  • Hybrid

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Hinton, J., Mirgkizoudi, M., Campos-Zatarain, A., Flynn, D., Harris, R. A., & Kay, R. W. (2018). Digitally-Driven Hybrid Manufacture of Ceramic Thick-Film Substrates. In 2018 7th Electronic System-Integration Technology Conference (ESTC) [8546442] IEEE. https://doi.org/10.1109/ESTC.2018.8546442
Hinton, J. ; Mirgkizoudi, M. ; Campos-Zatarain, A. ; Flynn, David ; Harris, R. A. ; Kay, R. W. / Digitally-Driven Hybrid Manufacture of Ceramic Thick-Film Substrates. 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE, 2018.
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Hinton, J, Mirgkizoudi, M, Campos-Zatarain, A, Flynn, D, Harris, RA & Kay, RW 2018, Digitally-Driven Hybrid Manufacture of Ceramic Thick-Film Substrates. in 2018 7th Electronic System-Integration Technology Conference (ESTC)., 8546442, IEEE, 7th Electronic System-Integration Technology Conference 2018, Dresden, Germany, 18/09/18. https://doi.org/10.1109/ESTC.2018.8546442

Digitally-Driven Hybrid Manufacture of Ceramic Thick-Film Substrates. / Hinton, J.; Mirgkizoudi, M.; Campos-Zatarain, A.; Flynn, David; Harris, R. A.; Kay, R. W.

2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE, 2018. 8546442.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Hinton J, Mirgkizoudi M, Campos-Zatarain A, Flynn D, Harris RA, Kay RW. Digitally-Driven Hybrid Manufacture of Ceramic Thick-Film Substrates. In 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE. 2018. 8546442 https://doi.org/10.1109/ESTC.2018.8546442