@inproceedings{1ef5c2c121fa48e8a033877f766e8fb5,
title = "Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip",
author = "Jackson, {G. J.} and Hendriksen, {M. W.} and Durairaj, {R. K.} and Ekere, {N. N.} and Desmulliez, {M. P Y} and Kay, {R. W.}",
year = "2003",
language = "English",
pages = "536--543",
booktitle = "Proceedings - Electronic Components and Technology Conference",
note = "53rd Electronic Components and Technology Conference 2003 ; Conference date: 27-05-2003 Through 30-05-2003",
}