Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip

G. J. Jackson, M. W. Hendriksen, R. K. Durairaj, N. N. Ekere, M. P Y Desmulliez, R. W. Kay

Research output: Chapter in Book/Report/Conference proceedingConference contribution

23 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages536-543
Number of pages8
Publication statusPublished - 2003
Event53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States
Duration: 27 May 200330 May 2003

Conference

Conference53rd Electronic Components and Technology Conference 2003
CountryUnited States
CityNew Orleans LA
Period27/05/0330/05/03

Cite this

Jackson, G. J., Hendriksen, M. W., Durairaj, R. K., Ekere, N. N., Desmulliez, M. P. Y., & Kay, R. W. (2003). Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip. In Proceedings - Electronic Components and Technology Conference (pp. 536-543)