Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip

G. J. Jackson, M. W. Hendriksen, R. K. Durairaj, N. N. Ekere, M. P Y Desmulliez, R. W. Kay

Research output: Chapter in Book/Report/Conference proceedingConference contribution

23 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages536-543
Number of pages8
Publication statusPublished - 2003
Event53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States
Duration: 27 May 200330 May 2003

Conference

Conference53rd Electronic Components and Technology Conference 2003
Country/TerritoryUnited States
CityNew Orleans LA
Period27/05/0330/05/03

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