Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip

G. J. Jackson, M. W. Hendriksen, R. K. Durairaj, N. N. Ekere, M. P Y Desmulliez, R. W. Kay

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English
Title of host publication	Proceedings - Electronic Components and Technology Conference
Pages	536-543
Number of pages	8
Publication status	Published - 2003
Event	53rd Electronic Components and Technology Conference 2003 - New Orleans LA, United States Duration: 27 May 2003 → 30 May 2003

Conference	53rd Electronic Components and Technology Conference 2003
Country/Territory	United States
City	New Orleans LA
Period	27/05/03 → 30/05/03

Cite this

@inproceedings{1ef5c2c121fa48e8a033877f766e8fb5,

title = "Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip",

author = "Jackson, {G. J.} and Hendriksen, {M. W.} and Durairaj, {R. K.} and Ekere, {N. N.} and Desmulliez, {M. P Y} and Kay, {R. W.}",

year = "2003",

language = "English",

pages = "536--543",

booktitle = "Proceedings - Electronic Components and Technology Conference",

note = "53rd Electronic Components and Technology Conference 2003 ; Conference date: 27-05-2003 Through 30-05-2003",

}

Jackson, GJ, Hendriksen, MW, Durairaj, RK, Ekere, NN, Desmulliez, MPY & Kay, RW 2003, Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip. in Proceedings - Electronic Components and Technology Conference. pp. 536-543, 53rd Electronic Components and Technology Conference 2003, New Orleans LA, United States, 27/05/03.

TY - GEN

T1 - Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip

AU - Jackson, G. J.

AU - Hendriksen, M. W.

AU - Durairaj, R. K.

AU - Ekere, N. N.

AU - Desmulliez, M. P Y

AU - Kay, R. W.

PY - 2003

Y1 - 2003

UR - http://www.scopus.com/inward/record.url?scp=0038350868&partnerID=8YFLogxK

M3 - Conference contribution

SP - 536

EP - 543

BT - Proceedings - Electronic Components and Technology Conference

T2 - 53rd Electronic Components and Technology Conference 2003

Y2 - 27 May 2003 through 30 May 2003

ER -