Development of the surface defect machining method for micro/nano scale material removal processes

Saurav Goel; Waleed Abdulrah Bin Rashid; Amir Mir; Shengyue Zeng; Jining Sun; X. Luo

Development of the surface defect machining method for micro/nano scale material removal processes

Saurav Goel, Waleed Abdulrah Bin Rashid, Amir Mir, Shengyue Zeng, Jining Sun, X. Luo

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

In this paper, a novel method named "surface defect machining" (SDM) which was previously applied to hard turning (HT) processes [1] has been applied to nanometric cutting. Using state-of-the-art tools of molecular dynamics simulation and single point diamond turning (SPDT) experiment, it has been shown that a well controlled SDM process can aid to bridge the gap of turning and polishing processes with respect to attainable machined surface roughness and reduced sub-surface damage.

Original language	English
Title of host publication	Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology
Publisher	Euspen
Pages	348-351
Number of pages	4
ISBN (Print)	9780956679024
Publication status	Published - 2013
Event	13th International Conference of the European Society for Precision Engineering and Nanotechnology 2013 - Berlin, Germany Duration: 27 May 2013 → 31 May 2013

Conference

Conference	13th International Conference of the European Society for Precision Engineering and Nanotechnology 2013
Abbreviated title	EUSPEN 2013
Country/Territory	Germany
City	Berlin
Period	27/05/13 → 31/05/13

Cite this

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title = "Development of the surface defect machining method for micro/nano scale material removal processes",

abstract = "In this paper, a novel method named {"}surface defect machining{"} (SDM) which was previously applied to hard turning (HT) processes [1] has been applied to nanometric cutting. Using state-of-the-art tools of molecular dynamics simulation and single point diamond turning (SPDT) experiment, it has been shown that a well controlled SDM process can aid to bridge the gap of turning and polishing processes with respect to attainable machined surface roughness and reduced sub-surface damage.",

author = "Saurav Goel and {Bin Rashid}, {Waleed Abdulrah} and Amir Mir and Shengyue Zeng and Jining Sun and X. Luo",

year = "2013",

language = "English",

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pages = "348--351",

booktitle = "Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology",

publisher = "Euspen",

note = "13th International Conference of the European Society for Precision Engineering and Nanotechnology 2013, EUSPEN 2013 ; Conference date: 27-05-2013 Through 31-05-2013",

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Goel, S, Bin Rashid, WA, Mir, A, Zeng, S, Sun, J & Luo, X 2013, Development of the surface defect machining method for micro/nano scale material removal processes. in Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology. Euspen, pp. 348-351, 13th International Conference of the European Society for Precision Engineering and Nanotechnology 2013, Berlin, Germany, 27/05/13.

Development of the surface defect machining method for micro/nano scale material removal processes. / Goel, Saurav; Bin Rashid, Waleed Abdulrah; Mir, Amir et al.
Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology. Euspen, 2013. p. 348-351.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Development of the surface defect machining method for micro/nano scale material removal processes

AU - Goel, Saurav

AU - Bin Rashid, Waleed Abdulrah

AU - Mir, Amir

AU - Zeng, Shengyue

AU - Sun, Jining

AU - Luo, X.

PY - 2013

Y1 - 2013

N2 - In this paper, a novel method named "surface defect machining" (SDM) which was previously applied to hard turning (HT) processes [1] has been applied to nanometric cutting. Using state-of-the-art tools of molecular dynamics simulation and single point diamond turning (SPDT) experiment, it has been shown that a well controlled SDM process can aid to bridge the gap of turning and polishing processes with respect to attainable machined surface roughness and reduced sub-surface damage.

AB - In this paper, a novel method named "surface defect machining" (SDM) which was previously applied to hard turning (HT) processes [1] has been applied to nanometric cutting. Using state-of-the-art tools of molecular dynamics simulation and single point diamond turning (SPDT) experiment, it has been shown that a well controlled SDM process can aid to bridge the gap of turning and polishing processes with respect to attainable machined surface roughness and reduced sub-surface damage.

M3 - Conference contribution

SN - 9780956679024

SP - 348

EP - 351

BT - Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology

PB - Euspen

T2 - 13th International Conference of the European Society for Precision Engineering and Nanotechnology 2013

Y2 - 27 May 2013 through 31 May 2013

ER -

Development of the surface defect machining method for micro/nano scale material removal processes

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