Development of the surface defect machining method for micro/nano scale material removal processes

Saurav Goel, Waleed Abdulrah Bin Rashid, Amir Mir, Shengyue Zeng, Jining Sun, X. Luo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this paper, a novel method named "surface defect machining" (SDM) which was previously applied to hard turning (HT) processes [1] has been applied to nanometric cutting. Using state-of-the-art tools of molecular dynamics simulation and single point diamond turning (SPDT) experiment, it has been shown that a well controlled SDM process can aid to bridge the gap of turning and polishing processes with respect to attainable machined surface roughness and reduced sub-surface damage.
Original languageEnglish
Title of host publicationProceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology
PublisherEuspen
Pages348-351
Number of pages4
ISBN (Print)9780956679024
Publication statusPublished - 2013
Event13th International Conference of the European Society for Precision Engineering and Nanotechnology 2013 - Berlin, Germany
Duration: 27 May 201331 May 2013

Conference

Conference13th International Conference of the European Society for Precision Engineering and Nanotechnology 2013
Abbreviated titleEUSPEN 2013
CountryGermany
CityBerlin
Period27/05/1331/05/13

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  • Cite this

    Goel, S., Bin Rashid, W. A., Mir, A., Zeng, S., Sun, J., & Luo, X. (2013). Development of the surface defect machining method for micro/nano scale material removal processes. In Proceedings of the 13th International Conference of the European Society for Precision Engineering and Nanotechnology (pp. 348-351). Euspen.