Development of packaged UWB passive devices using LCP multilayer circuit technology

Francisco Cervera*, Jiasheng Hong, Neil Thomson

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Development of packaged UWB passive devices using LCP multilayer circuit technology'. Together they form a unique fingerprint.

INIS

Engineering

Material Science