Development of packaged UWB passive devices using LCP multilayer circuit technology

Francisco Cervera; Jiasheng Hong; Neil Thomson

Development of packaged UWB passive devices using LCP multilayer circuit technology

Francisco Cervera^*, Jiasheng Hong, Neil Thomson

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

A novel method for near-hermetic packaging of integrated UWB passive devices based on multilayer liquid crystal polymer technology is presented in this paper. The aim of this work is to develop a cheap, easy-to-manufacture procedure that can be used to enclose already designed devices without the need of any redesign, and works up to 20GHz. To achieve this, a coplanar waveguide-to-microstrip (CPW-MS) transition is designed to connect the enclosed device with the outer environment. This allows for the device to be PCB mounted as well as providing isolation. Two experiments are presented to validate this approach: an enclosed MS line, in order to measure the losses introduced by the packaging; and then a real ultra wideband (UWB) filter replacing the MS line using the same packaging. Simulated and measured results are provided in order to validate this approach.

Original language	English
Title of host publication	2012 42nd European Microwave Conference
Publisher	IEEE
Pages	1150-1153
Number of pages	4
ISBN (Electronic)	9782874870279
ISBN (Print)	9781467322157
Publication status	Published - 11 Feb 2013
Event	42nd European Microwave Conference 2012 - Amsterdam, Netherlands Duration: 29 Oct 2012 → 1 Nov 2012

Conference

Conference	42nd European Microwave Conference 2012
Abbreviated title	EuMC 2012
Country/Territory	Netherlands
City	Amsterdam
Period	29/10/12 → 1/11/12

Keywords

coplanar waveguide
liquid crystal polymer
microstrip
microwave filter
UWB filter
wideband transition

ASJC Scopus subject areas

Electrical and Electronic Engineering

Cite this

@inproceedings{7f99a3da9b8040ca9f629c69b2da429e,

title = "Development of packaged UWB passive devices using LCP multilayer circuit technology",

abstract = "A novel method for near-hermetic packaging of integrated UWB passive devices based on multilayer liquid crystal polymer technology is presented in this paper. The aim of this work is to develop a cheap, easy-to-manufacture procedure that can be used to enclose already designed devices without the need of any redesign, and works up to 20GHz. To achieve this, a coplanar waveguide-to-microstrip (CPW-MS) transition is designed to connect the enclosed device with the outer environment. This allows for the device to be PCB mounted as well as providing isolation. Two experiments are presented to validate this approach: an enclosed MS line, in order to measure the losses introduced by the packaging; and then a real ultra wideband (UWB) filter replacing the MS line using the same packaging. Simulated and measured results are provided in order to validate this approach.",

keywords = "coplanar waveguide, liquid crystal polymer, microstrip, microwave filter, UWB filter, wideband transition",

author = "Francisco Cervera and Jiasheng Hong and Neil Thomson",

year = "2013",

month = feb,

day = "11",

language = "English",

isbn = "9781467322157",

pages = "1150--1153",

booktitle = "2012 42nd European Microwave Conference",

publisher = "IEEE",

address = "United States",

note = "42nd European Microwave Conference 2012, EuMC 2012 ; Conference date: 29-10-2012 Through 01-11-2012",

}

TY - GEN

T1 - Development of packaged UWB passive devices using LCP multilayer circuit technology

AU - Cervera, Francisco

AU - Hong, Jiasheng

AU - Thomson, Neil

PY - 2013/2/11

Y1 - 2013/2/11

N2 - A novel method for near-hermetic packaging of integrated UWB passive devices based on multilayer liquid crystal polymer technology is presented in this paper. The aim of this work is to develop a cheap, easy-to-manufacture procedure that can be used to enclose already designed devices without the need of any redesign, and works up to 20GHz. To achieve this, a coplanar waveguide-to-microstrip (CPW-MS) transition is designed to connect the enclosed device with the outer environment. This allows for the device to be PCB mounted as well as providing isolation. Two experiments are presented to validate this approach: an enclosed MS line, in order to measure the losses introduced by the packaging; and then a real ultra wideband (UWB) filter replacing the MS line using the same packaging. Simulated and measured results are provided in order to validate this approach.

AB - A novel method for near-hermetic packaging of integrated UWB passive devices based on multilayer liquid crystal polymer technology is presented in this paper. The aim of this work is to develop a cheap, easy-to-manufacture procedure that can be used to enclose already designed devices without the need of any redesign, and works up to 20GHz. To achieve this, a coplanar waveguide-to-microstrip (CPW-MS) transition is designed to connect the enclosed device with the outer environment. This allows for the device to be PCB mounted as well as providing isolation. Two experiments are presented to validate this approach: an enclosed MS line, in order to measure the losses introduced by the packaging; and then a real ultra wideband (UWB) filter replacing the MS line using the same packaging. Simulated and measured results are provided in order to validate this approach.

KW - coplanar waveguide

KW - liquid crystal polymer

KW - microstrip

KW - microwave filter

KW - UWB filter

KW - wideband transition

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M3 - Conference contribution

AN - SCOPUS:84874621826

SN - 9781467322157

SP - 1150

EP - 1153

BT - 2012 42nd European Microwave Conference

PB - IEEE

T2 - 42nd European Microwave Conference 2012

Y2 - 29 October 2012 through 1 November 2012

ER -

Development of packaged UWB passive devices using LCP multilayer circuit technology

Abstract

Conference

Keywords

ASJC Scopus subject areas

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