Development of packaged UWB passive devices using LCP multilayer circuit technology

Francisco Cervera*, Jiasheng Hong, Neil Thomson

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)


A novel method for near-hermetic packaging of integrated UWB passive devices based on multilayer liquid crystal polymer technology is presented in this paper. The aim of this work is to develop a cheap, easy-to-manufacture procedure that can be used to enclose already designed devices without the need of any redesign, and works up to 20GHz. To achieve this, a coplanar waveguide-to-microstrip (CPW-MS) transition is designed to connect the enclosed device with the outer environment. This allows for the device to be PCB mounted as well as providing isolation. Two experiments are presented to validate this approach: an enclosed MS line, in order to measure the losses introduced by the packaging; and then a real ultra wideband (UWB) filter replacing the MS line using the same packaging. Simulated and measured results are provided in order to validate this approach.

Original languageEnglish
Title of host publication2012 42nd European Microwave Conference
Number of pages4
ISBN (Electronic)9782874870279
ISBN (Print)9781467322157
Publication statusPublished - 11 Feb 2013
Event42nd European Microwave Conference 2012 - Amsterdam, Netherlands
Duration: 29 Oct 20121 Nov 2012


Conference42nd European Microwave Conference 2012
Abbreviated titleEuMC 2012


  • coplanar waveguide
  • liquid crystal polymer
  • microstrip
  • microwave filter
  • UWB filter
  • wideband transition

ASJC Scopus subject areas

  • Electrical and Electronic Engineering


Dive into the research topics of 'Development of packaged UWB passive devices using LCP multilayer circuit technology'. Together they form a unique fingerprint.

Cite this