Development of packaged UWB passive devices using LCP multilayer circuit technology

Francisco Cervera*, Jiasheng Hong, Neil Thomson

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)


A novel method for near-hermetic packaging of integrated UWB passive devices based on multilayer liquid crystal polymer technology is presented in this paper. The aim of this work is to develop a cheap, easy-to-manufacture procedure that can be used to enclose already designed devices without the need of any redesign, and works up to 20GHz. To achieve this, a coplanar waveguide-to-microstrip (CPW-MS) transition is designed to connect the enclosed device with the outer environment. This allows for the device to be PCB mounted as well as providing isolation. Two experiments are presented to validate this approach: an enclosed MS line, in order to measure the losses introduced by the packaging; and then a real ultra wideband (UWB) filter replacing the MS line using the same packaging. Simulated and measured results are provided in order to validate this approach.

Original languageEnglish
Title of host publication2012 7th European Microwave Integrated Circuit Conference
Number of pages4
ISBN (Electronic)9782874870286
ISBN (Print)9781467323024
Publication statusPublished - 21 Mar 2013
Event7th European Microwave Integrated Circuits Conference 2012 - Amsterdam, Netherlands
Duration: 29 Oct 201230 Oct 2012


Conference7th European Microwave Integrated Circuits Conference 2012


  • coplanar waveguide
  • liquid crystal polymer
  • microstrip
  • microwave filter
  • UWB filter
  • wideband transition

ASJC Scopus subject areas

  • Hardware and Architecture


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