Development of B-spline X-ray Diffraction Imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips

C. S. Wong, A. Ivankovic, Nick Bennett, A. Cowley, A. N. Danilewsky, M. Gonzalez, V. Cherman, B. Vandevelde, I. De Wolf, P. J. McNally

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science