Development of B-spline X-ray Diffraction Imaging techniques for die warpage and stress monitoring inside fully encapsulated packaged chips

C. S. Wong*, A. Ivankovic, Nick Bennett, A. Cowley, A. N. Danilewsky, M. Gonzalez, V. Cherman, B. Vandevelde, I. De Wolf, P. J. McNally

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

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