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Development and Testing of Microscale Magnetic Components
David Flynn
School of Engineering & Physical Sciences
Institute of Sensors, Signals & Systems
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peer-review
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INIS
power
100%
testing
100%
iron
75%
levels
50%
losses
50%
cobalt
50%
inductance
50%
inductors
50%
packaging
50%
growth
25%
comparative evaluations
25%
copper
25%
industry
25%
performance
25%
efficiency
25%
alloys
25%
thin films
25%
khz range
25%
integrated circuits
25%
frequency range
25%
impedance
25%
bonding
25%
silicon
25%
hysteresis
25%
capacitance
25%
eddy currents
25%
transformers
25%
power density
25%
consumer products
25%
nickel alloys
25%
Engineering
Microscale
100%
Microinductor
100%
Power Density
50%
Integrated Circuit
50%
Power Converter
50%
Iron Core
50%
Eddy Current Loss
50%
Chip Bonding
50%
Hysteresis Loss
50%
Parasitic Capacitance
50%
System-on-Chip
50%
Technology Integration
50%
System-in-Package
50%
Thin Films
50%
Q Factor
50%
Consumer Product
50%
Electronics Industry
50%