Within this era of communications there are numerous Integrated Circuit (IC) packaging technology challenges that need to be addressed in the next five years. Consumer products are driving the majority of the electronics industry growth in the next decade; these products generally priorities power over performance. The emergence of System on Chip (SoC) and System in Package (SiP) is driving more complexity, functionality, and heterogeneous technology integration. Power has become a key technology hurdle, both at the silicon level, as well as at the packaging and system level. The issue of power focusing on the traditionally bulky conventional transformers and inductors of DC/DC power converters is addressed in this paper. A novel method to manufacture a microinductor that is based on flip-chip bonding assembly is described. The component structure permits the comparison of commercially available alloys, Vitrovac 6025 and metaglas 2605S3A, and electroplated alloys, nickel-iron and cobalt-iron. The fabricated inductors have an inductance ranging from 0.3µH to 180µH. An optimum Q-factor of 14 was attained at 1MHz. Cobalt-Copper-iron cores maintained a constant inductance across a 1 kHz-1MHz bandwidth. The thin film laminate minimizes the eddy current loss and the hysteresis loss was negligible. Impedance increases linearly with frequency indicating that parasitic capacitance effects in this frequency range are negligible. The microinductor operated at an efficiency of 92% at 1MHz achieving a power density of 3.75 W/mm³.
|Publication status||Published - 2006|
|Event||MicroTech 2006: iMAPS UK Technical Conference - Moeller Centre, Cambridge, United Kingdom|
Duration: 7 Mar 2006 → 8 Mar 2006
|Abbreviated title||iMAPS 2006|
|Period||7/03/06 → 8/03/06|