Determination of mechanical parameters of solder materials using the miniature measuring method "small punch test" and an appropriate FE-simulation

K. P. Herrmann; Wolfgang Muller; V. S. Nguyen

Determination of mechanical parameters of solder materials using the miniature measuring method "small punch test" and an appropriate FE-simulation

K. P. Herrmann, Wolfgang Muller, V. S. Nguyen

School of Engineering & Physical Sciences

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	S427-S428
Journal	Zeitschrift für Angewandte Mathematik und Mechanik
Volume	80
Issue number	4 SUPPL. 2
Publication status	Published - 2000

Cite this

@article{c1180388214a427abaf450718969d859,

title = "Determination of mechanical parameters of solder materials using the miniature measuring method {"}small punch test{"} and an appropriate FE-simulation",

author = "Herrmann, \{K. P.\} and Wolfgang Muller and Nguyen, \{V. S.\}",

year = "2000",

language = "English",

volume = "80",

pages = "S427--S428",

journal = "Zeitschrift f{\"u}r Angewandte Mathematik und Mechanik",

issn = "0044-2267",

publisher = "Wiley-VCH Verlag",

number = "4 SUPPL. 2",

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TY - JOUR

T1 - Determination of mechanical parameters of solder materials using the miniature measuring method "small punch test" and an appropriate FE-simulation

AU - Herrmann, K. P.

AU - Muller, Wolfgang

AU - Nguyen, V. S.

PY - 2000

Y1 - 2000

UR - https://www.scopus.com/pages/publications/33748073111

M3 - Article

SN - 0044-2267

VL - 80

SP - S427-S428

JO - Zeitschrift für Angewandte Mathematik und Mechanik

JF - Zeitschrift für Angewandte Mathematik und Mechanik

IS - 4 SUPPL. 2

ER -

Determination of mechanical parameters of solder materials using the miniature measuring method "small punch test" and an appropriate FE-simulation

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