Determination of mechanical parameters of solder materials using the miniature measuring method "small punch test" and an appropriate FE-simulation

K. P. Herrmann, Wolfgang Muller, V. S. Nguyen

Research output: Contribution to journalArticle

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)S427-S428
JournalZeitschrift für Angewandte Mathematik und Mechanik
Volume80
Issue number4 SUPPL. 2
Publication statusPublished - 2000

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