Determination of mechanical parameters of solder materials using the miniature measuring method "small punch test" and an appropriate FE-simulation

K. P. Herrmann, Wolfgang Muller, V. S. Nguyen

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)S427-S428
JournalZeitschrift für Angewandte Mathematik und Mechanik
Volume80
Issue number4 SUPPL. 2
Publication statusPublished - 2000

Cite this

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title = "Determination of mechanical parameters of solder materials using the miniature measuring method {"}small punch test{"} and an appropriate FE-simulation",
author = "Herrmann, {K. P.} and Wolfgang Muller and Nguyen, {V. S.}",
year = "2000",
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issn = "0044-2267",
publisher = "Wiley-VCH Verlag",
number = "4 SUPPL. 2",

}

Determination of mechanical parameters of solder materials using the miniature measuring method "small punch test" and an appropriate FE-simulation. / Herrmann, K. P.; Muller, Wolfgang; Nguyen, V. S.

In: Zeitschrift für Angewandte Mathematik und Mechanik, Vol. 80, No. 4 SUPPL. 2, 2000, p. S427-S428.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Determination of mechanical parameters of solder materials using the miniature measuring method "small punch test" and an appropriate FE-simulation

AU - Herrmann, K. P.

AU - Muller, Wolfgang

AU - Nguyen, V. S.

PY - 2000

Y1 - 2000

UR - http://www.scopus.com/inward/record.url?scp=33748073111&partnerID=8YFLogxK

M3 - Article

VL - 80

SP - S427-S428

JO - Zeitschrift für Angewandte Mathematik und Mechanik

JF - Zeitschrift für Angewandte Mathematik und Mechanik

SN - 0044-2267

IS - 4 SUPPL. 2

ER -