Original language | English |
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Pages (from-to) | S427-S428 |
Journal | Zeitschrift für Angewandte Mathematik und Mechanik |
Volume | 80 |
Issue number | 4 SUPPL. 2 |
Publication status | Published - 2000 |
Determination of mechanical parameters of solder materials using the miniature measuring method "small punch test" and an appropriate FE-simulation
K. P. Herrmann, Wolfgang Muller, V. S. Nguyen
Research output: Contribution to journal › Article › peer-review
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Citation
(Scopus)