Detecting underfill delamination and cracks in flip chip on board assemblies using infrared microscope

Jicun Lu, Alastair Trigg, J Wu, Taichong Chai

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Infrared Microscopy (IRM) inspection of underfill delamination and cracks in Flip Chip board (FCOB) assemblies is reported in this work. The location and extent of chip/underfill delamination has been determined. Internal cracks in underfill can also be detected by IRM. Compared to scanning acoustic microscopy (SAM), IRM technique provides higher resolution images of underfill related failures and eliminates the `edge effect' which occurs in SAM. Underfill failures detected by IRM have been verified by destructive physical analysis, microscopy, and scanning electronic microscopy (SEM).

Original languageEnglish
Pages (from-to)231-236
Number of pages6
JournalInternational Journal of Microcircuits and Electronic Packaging
Volume21
Issue number3
Publication statusPublished - Sep 1998

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