Design methodology and manufacture of a microinductor

D. Flynn; M. P Y Desmulliez

doi:10.1109/DTIP.2008.4753019

Design methodology and manufacture of a microinductor

D. Flynn, M. P Y Desmulliez

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Potential core materials to supersede ferrite in the 0.5-10 MHz frequency range are investigated. The performance of electrodeposited nickel-iron, cobalt-iron-copper alloys and the commercial alloy Vitrovac 6025 have been assessed through their inclusion within a custom-made solenoid microinductor. Although the present inductor, at 500 KHz, achieves 77% power efficiency for 24.7W/cm³ power density, an optimized process predicts a power efficiency of 97% for 30.83W/cm³ power density. The principle issues regarding microinductor design and performance are discussed. ©EDA Publishing/DTIP 2008.

Original language	English
Title of host publication	DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Pages	364-369
Number of pages	6
DOIs	https://doi.org/10.1109/DTIP.2008.4753019
Publication status	Published - 2008
Event	DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Nice, France Duration: 9 Apr 2008 → 11 Apr 2008

Conference

Conference	DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Country/Territory	France
City	Nice
Period	9/04/08 → 11/04/08

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10.1109/DTIP.2008.4753019

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@inproceedings{655a3b2b3ff24adb82a884e3c1968cc4,

title = "Design methodology and manufacture of a microinductor",

abstract = "Potential core materials to supersede ferrite in the 0.5-10 MHz frequency range are investigated. The performance of electrodeposited nickel-iron, cobalt-iron-copper alloys and the commercial alloy Vitrovac 6025 have been assessed through their inclusion within a custom-made solenoid microinductor. Although the present inductor, at 500 KHz, achieves 77% power efficiency for 24.7W/cm3 power density, an optimized process predicts a power efficiency of 97% for 30.83W/cm3 power density. The principle issues regarding microinductor design and performance are discussed. {\textcopyright}EDA Publishing/DTIP 2008.",

author = "D. Flynn and Desmulliez, {M. P Y}",

year = "2008",

doi = "10.1109/DTIP.2008.4753019",

language = "English",

isbn = "9782355000065",

pages = "364--369",

booktitle = "DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS",

note = "DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS ; Conference date: 09-04-2008 Through 11-04-2008",

}

TY - GEN

T1 - Design methodology and manufacture of a microinductor

AU - Flynn, D.

AU - Desmulliez, M. P Y

PY - 2008

Y1 - 2008

N2 - Potential core materials to supersede ferrite in the 0.5-10 MHz frequency range are investigated. The performance of electrodeposited nickel-iron, cobalt-iron-copper alloys and the commercial alloy Vitrovac 6025 have been assessed through their inclusion within a custom-made solenoid microinductor. Although the present inductor, at 500 KHz, achieves 77% power efficiency for 24.7W/cm3 power density, an optimized process predicts a power efficiency of 97% for 30.83W/cm3 power density. The principle issues regarding microinductor design and performance are discussed. ©EDA Publishing/DTIP 2008.

AB - Potential core materials to supersede ferrite in the 0.5-10 MHz frequency range are investigated. The performance of electrodeposited nickel-iron, cobalt-iron-copper alloys and the commercial alloy Vitrovac 6025 have been assessed through their inclusion within a custom-made solenoid microinductor. Although the present inductor, at 500 KHz, achieves 77% power efficiency for 24.7W/cm3 power density, an optimized process predicts a power efficiency of 97% for 30.83W/cm3 power density. The principle issues regarding microinductor design and performance are discussed. ©EDA Publishing/DTIP 2008.

U2 - 10.1109/DTIP.2008.4753019

DO - 10.1109/DTIP.2008.4753019

M3 - Conference contribution

SN - 9782355000065

SP - 364

EP - 369

BT - DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

T2 - DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Y2 - 9 April 2008 through 11 April 2008

ER -

Design methodology and manufacture of a microinductor

Abstract

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