Design, Manufacturing and Packaging of High Frequency Micro Ultrasonic Transducers for Medical Applications

David Flynn; Marc Phillipe Yves Desmulliez; Jack Hoy-Gig Ng; Robert W Kay; Sandy Cochran

Design, Manufacturing and Packaging of High Frequency Micro Ultrasonic Transducers for Medical Applications

David Flynn, Marc Phillipe Yves Desmulliez, Jack Hoy-Gig Ng, Robert W Kay, Sandy Cochran

Research output: Contribution to conference › Paper › peer-review

Abstract

The challenges for the realization of a miniaturized high frequency ultrasonic transducer linear array lie in the interconnections on the fine pitch piezoceramic elements. Within the footprint the size of a needle, only peripheral interconnections can be allowed on the transducer array such that the acoustic operations on both faces of the vibrating piezoelectric elements are not obstructed. The very low maximum processing temperature allowed also poses difficulty for conventional bonding techniques. This article presents 3-dimensional packaging using spirally rolled flexible circuits, room-temperature anisotropic conductive bonding and stencil printing for the setup of a wafer-level production process flow.

Original language	English
Publication status	Published - 12 Sept 2011
Event	13th Electronics Packaging Technology Conference, 2011: ESTC - Shangri-La Hotel, Singapore, Singapore Duration: 7 Dec 2011 → 9 Dec 2011 Conference number: 19841 http://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=19841

Conference

Conference	13th Electronics Packaging Technology Conference, 2011
Abbreviated title	EPTC 2011
Country/Territory	Singapore
City	Singapore
Period	7/12/11 → 9/12/11
Other	Advanced Electronics Packaging Technologies
Internet address	http://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=19841

Cite this

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title = "Design, Manufacturing and Packaging of High Frequency Micro Ultrasonic Transducers for Medical Applications",

abstract = "The challenges for the realization of a miniaturized high frequency ultrasonic transducer linear array lie in the interconnections on the fine pitch piezoceramic elements. Within the footprint the size of a needle, only peripheral interconnections can be allowed on the transducer array such that the acoustic operations on both faces of the vibrating piezoelectric elements are not obstructed. The very low maximum processing temperature allowed also poses difficulty for conventional bonding techniques. This article presents 3-dimensional packaging using spirally rolled flexible circuits, room-temperature anisotropic conductive bonding and stencil printing for the setup of a wafer-level production process flow.",

author = "David Flynn and Desmulliez, {Marc Phillipe Yves} and Ng, {Jack Hoy-Gig} and Kay, {Robert W} and Sandy Cochran",

year = "2011",

month = sep,

day = "12",

language = "English",

note = "13th Electronics Packaging Technology Conference, 2011 : ESTC, EPTC 2011 ; Conference date: 07-12-2011 Through 09-12-2011",

url = "http://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=19841",

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TY - CONF

T1 - Design, Manufacturing and Packaging of High Frequency Micro Ultrasonic Transducers for Medical Applications

AU - Flynn, David

AU - Desmulliez, Marc Phillipe Yves

AU - Ng, Jack Hoy-Gig

AU - Kay, Robert W

AU - Cochran, Sandy

N1 - Conference code: 19841

PY - 2011/9/12

Y1 - 2011/9/12

N2 - The challenges for the realization of a miniaturized high frequency ultrasonic transducer linear array lie in the interconnections on the fine pitch piezoceramic elements. Within the footprint the size of a needle, only peripheral interconnections can be allowed on the transducer array such that the acoustic operations on both faces of the vibrating piezoelectric elements are not obstructed. The very low maximum processing temperature allowed also poses difficulty for conventional bonding techniques. This article presents 3-dimensional packaging using spirally rolled flexible circuits, room-temperature anisotropic conductive bonding and stencil printing for the setup of a wafer-level production process flow.

AB - The challenges for the realization of a miniaturized high frequency ultrasonic transducer linear array lie in the interconnections on the fine pitch piezoceramic elements. Within the footprint the size of a needle, only peripheral interconnections can be allowed on the transducer array such that the acoustic operations on both faces of the vibrating piezoelectric elements are not obstructed. The very low maximum processing temperature allowed also poses difficulty for conventional bonding techniques. This article presents 3-dimensional packaging using spirally rolled flexible circuits, room-temperature anisotropic conductive bonding and stencil printing for the setup of a wafer-level production process flow.

M3 - Paper

T2 - 13th Electronics Packaging Technology Conference, 2011

Y2 - 7 December 2011 through 9 December 2011

ER -

Design, Manufacturing and Packaging of High Frequency Micro Ultrasonic Transducers for Medical Applications

Abstract

Conference

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