Design, Manufacturing and Packaging of High Frequency Micro Ultrasonic Transducers for Medical Applications

David Flynn, Marc Phillipe Yves Desmulliez, Jack Hoy-Gig Ng, Robert W Kay, Sandy Cochran

Research output: Contribution to conferencePaper

2 Citations (Scopus)

Abstract

The challenges for the realization of a miniaturized high frequency ultrasonic transducer linear array lie in the interconnections on the fine pitch piezoceramic elements. Within the footprint the size of a needle, only peripheral interconnections can be allowed on the transducer array such that the acoustic operations on both faces of the vibrating piezoelectric elements are not obstructed. The very low maximum processing temperature allowed also poses difficulty for conventional bonding techniques. This article presents 3-dimensional packaging using spirally rolled flexible circuits, room-temperature anisotropic conductive bonding and stencil printing for the setup of a wafer-level production process flow.
Original languageEnglish
Publication statusPublished - 12 Sep 2011
Event13th Electronics Packaging Technology Conference, 2011: ESTC - Shangri-La Hotel, Singapore, Singapore
Duration: 7 Dec 20119 Dec 2011
Conference number: 19841
http://www.ieee.org/conferences_events/conferences/conferencedetails/index.html?Conf_ID=19841

Conference

Conference13th Electronics Packaging Technology Conference, 2011
Abbreviated titleEPTC 2011
CountrySingapore
CitySingapore
Period7/12/119/12/11
OtherAdvanced Electronics Packaging Technologies
Internet address

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  • Cite this

    Flynn, D., Desmulliez, M. P. Y., Ng, J. H-G., Kay, R. W., & Cochran, S. (2011). Design, Manufacturing and Packaging of High Frequency Micro Ultrasonic Transducers for Medical Applications. Paper presented at 13th Electronics Packaging Technology Conference, 2011, Singapore, Singapore.