@inproceedings{206b5451f97b443285ac6fb642050868,
title = "Design, manufacture and testing of a low-cost micro-channel cooling device",
abstract = "The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The device is to be used in microelectronic packaging cooling applications. The nickel-based micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from the UV-LIGA (UV-Lithography, Electroforming, Replication) process. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate has been tested using a custom-made rig to measure the flow pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented. {\textcopyright} 2004 IEEE.",
author = "AJ Pang and MPY Desmulliez and M Leonard and RS Dhariwal and RL Reuben and AS Holmes and G Hong and KR Pullen and F Waldron and O Slattery and M Rencz and DR Emerson and RW Barber",
year = "2004",
language = "English",
isbn = "0780388216",
series = "Electronics Packaging Technology Conference Proceedings",
publisher = "IEEE",
pages = "564--568",
editor = "KC Toh and YC Mui and J How and JHL Pang",
booktitle = "Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004",
address = "United States",
note = "6th Electronics Packaging Technology Conference ; Conference date: 08-12-2004 Through 10-12-2004",
}