Design, manufacture and testing of a low-cost micro-channel cooling device

AJ Pang, MPY Desmulliez, M Leonard, RS Dhariwal, RL Reuben, AS Holmes, G Hong, KR Pullen, F Waldron, O Slattery, M Rencz, DR Emerson, RW Barber

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The device is to be used in microelectronic packaging cooling applications. The nickel-based micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from the UV-LIGA (UV-Lithography, Electroforming, Replication) process. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate has been tested using a custom-made rig to measure the flow pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented. © 2004 IEEE.

Original languageEnglish
Title of host publicationProceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
EditorsKC Toh, YC Mui, J How, JHL Pang
PublisherIEEE
Pages564-568
Number of pages5
ISBN (Print)0780388216, 9780780388215
Publication statusPublished - 2004
Event6th Electronics Packaging Technology Conference - Singapore, Singapore
Duration: 8 Dec 200410 Dec 2004

Publication series

NameElectronics Packaging Technology Conference Proceedings
PublisherIEEE

Conference

Conference6th Electronics Packaging Technology Conference
CountrySingapore
CitySingapore
Period8/12/0410/12/04

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