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Design, fabrication, and characterization of flip-chip bonded microinductors
David Flynn
,
M. P Y Desmulliez
School of Engineering & Physical Sciences
Research output
:
Contribution to journal
›
Article
›
peer-review
9
Citations (Scopus)
Overview
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Engineering
Microinductor
100%
Design
75%
Iron
75%
Performance
50%
Efficiency
50%
Prototype
25%
Fabrication
25%
Performance Characteristic
25%
Gas Fuel Manufacture
25%
Power Density
25%
Commercial Alloy
25%
Core Material
25%
Lamination
25%
Inductance Value
25%
Magnetic Core
25%
Frequency Range
25%
Power Output
25%
Physics
Iron
75%
Performance
50%
Nickel
50%
Ferrite
25%
Cobalt
25%
Copper Alloys
25%
Fabrication
25%
Inclusions
25%
Frequency Ranges
25%
Material Science
Laminate
50%
Characterization
25%
Inclusion
25%
Ferrite
25%
Devices
25%
Material
25%
Materials Property
25%