Demonstration of chip-to-chip quantum teleportation

Y. Ding; D. Llewellyn; I. Faruque; S. Paesani; D. Bacco; R. Santagati; Y. Qian; Y. Li; Y. Xiao; M. Huber; M. Malik; G. Sinclair; X. Zhou; K. Rottwitt; J. O’Brien; J. Rarity; Q. Gong; L. Oxenlowe; J. Wang; M. Thompson

doi:10.1364/CLEO_AT.2019.JTh5C.4

Demonstration of chip-to-chip quantum teleportation

Y. Ding, D. Llewellyn, I. Faruque, S. Paesani, D. Bacco, R. Santagati, Y. Qian, Y. Li, Y. Xiao, M. Huber, M. Malik, G. Sinclair, X. Zhou, K. Rottwitt, J. O’Brien, J. Rarity, Q. Gong, L. Oxenlowe, J. Wang^*, M. Thompson

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

89 Downloads (Pure)

Abstract

We report the first experimental demonstration of chip-to-chip teleportation of quantum states of light. Integrated quantum transceivers in silicon are able to prepare, manipulate, distribute and transceive quantum photonic states with high fidelity.

Original language	English
Title of host publication	CLEO
Subtitle of host publication	Applications and Technology 2019
Publisher	OSA Publishing
ISBN (Electronic)	9781943580576
DOIs	https://doi.org/10.1364/CLEO_AT.2019.JTh5C.4
Publication status	Published - 5 May 2019
Event	CLEO: Applications and Technology 2019 - San Jose, United States Duration: 5 May 2019 → 10 May 2019

Conference

Conference	CLEO: Applications and Technology 2019
Country/Territory	United States
City	San Jose
Period	5/05/19 → 10/05/19

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Mechanics of Materials

Access to Document

10.1364/CLEO_AT.2019.JTh5C.4

Download pdf
© 2019 Optical Society of America. One print or electronic copy may be made for personal use only. Systematic reproduction and distribution, duplication of any material in this paper for a fee or for commercial purposes, or modifications of the content of this paper are prohibited.
Accepted author manuscript, 7.64 MB

Cite this

Ding, Y., Llewellyn, D., Faruque, I., Paesani, S., Bacco, D., Santagati, R., Qian, Y., Li, Y., Xiao, Y., Huber, M., Malik, M., Sinclair, G., Zhou, X., Rottwitt, K., O’Brien, J., Rarity, J., Gong, Q., Oxenlowe, L., Wang, J., & Thompson, M. (2019). Demonstration of chip-to-chip quantum teleportation. In CLEO: Applications and Technology 2019 Article JTh5C.4 OSA Publishing. https://doi.org/10.1364/CLEO_AT.2019.JTh5C.4

@inproceedings{4a8598f7612f43bc8d3614353b8d0a21,

title = "Demonstration of chip-to-chip quantum teleportation",

abstract = "We report the first experimental demonstration of chip-to-chip teleportation of quantum states of light. Integrated quantum transceivers in silicon are able to prepare, manipulate, distribute and transceive quantum photonic states with high fidelity.",

author = "Y. Ding and D. Llewellyn and I. Faruque and S. Paesani and D. Bacco and R. Santagati and Y. Qian and Y. Li and Y. Xiao and M. Huber and M. Malik and G. Sinclair and X. Zhou and K. Rottwitt and J. O{\textquoteright}Brien and J. Rarity and Q. Gong and L. Oxenlowe and J. Wang and M. Thompson",

year = "2019",

month = may,

day = "5",

doi = "10.1364/CLEO\_AT.2019.JTh5C.4",

language = "English",

booktitle = "CLEO",

publisher = "OSA Publishing",

address = "United States",

note = "CLEO: Applications and Technology 2019 ; Conference date: 05-05-2019 Through 10-05-2019",

}

Ding, Y, Llewellyn, D, Faruque, I, Paesani, S, Bacco, D, Santagati, R, Qian, Y, Li, Y, Xiao, Y, Huber, M, Malik, M, Sinclair, G, Zhou, X, Rottwitt, K, O’Brien, J, Rarity, J, Gong, Q, Oxenlowe, L, Wang, J & Thompson, M 2019, Demonstration of chip-to-chip quantum teleportation. in CLEO: Applications and Technology 2019., JTh5C.4, OSA Publishing, CLEO: Applications and Technology 2019, San Jose, United States, 5/05/19. https://doi.org/10.1364/CLEO_AT.2019.JTh5C.4

TY - GEN

T1 - Demonstration of chip-to-chip quantum teleportation

AU - Ding, Y.

AU - Llewellyn, D.

AU - Faruque, I.

AU - Paesani, S.

AU - Bacco, D.

AU - Santagati, R.

AU - Qian, Y.

AU - Li, Y.

AU - Xiao, Y.

AU - Huber, M.

AU - Malik, M.

AU - Sinclair, G.

AU - Zhou, X.

AU - Rottwitt, K.

AU - O’Brien, J.

AU - Rarity, J.

AU - Gong, Q.

AU - Oxenlowe, L.

AU - Wang, J.

AU - Thompson, M.

PY - 2019/5/5

Y1 - 2019/5/5

N2 - We report the first experimental demonstration of chip-to-chip teleportation of quantum states of light. Integrated quantum transceivers in silicon are able to prepare, manipulate, distribute and transceive quantum photonic states with high fidelity.

AB - We report the first experimental demonstration of chip-to-chip teleportation of quantum states of light. Integrated quantum transceivers in silicon are able to prepare, manipulate, distribute and transceive quantum photonic states with high fidelity.

UR - https://www.scopus.com/pages/publications/85068115349

U2 - 10.1364/CLEO_AT.2019.JTh5C.4

DO - 10.1364/CLEO_AT.2019.JTh5C.4

M3 - Conference contribution

AN - SCOPUS:85068115349

BT - CLEO

PB - OSA Publishing

T2 - CLEO: Applications and Technology 2019

Y2 - 5 May 2019 through 10 May 2019

ER -

Demonstration of chip-to-chip quantum teleportation

Abstract

Conference

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this