Demonstration of chip-to-chip quantum teleportation

Y. Ding, D. Llewellyn, I. Faruque, S. Paesani, D. Bacco, R. Santagati, Y. Qian, Y. Li, Y. Xiao, M. Huber, M. Malik, G. Sinclair, X. Zhou, K. Rottwitt, J. O’Brien, J. Rarity, Q. Gong, L. Oxenlowe, J. Wang, M. Thompson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Abstract

We report the first experimental demonstration of chip-to-chip teleportation of quantum states of light. Integrated quantum transceivers in silicon are able to prepare, manipulate, distribute and transceive quantum photonic states with high fidelity.

Original languageEnglish
Title of host publicationCLEO
Subtitle of host publicationApplications and Technology 2019
PublisherOptical Society of America
ISBN (Electronic)9781943580576
DOIs
Publication statusPublished - 5 May 2019
EventCLEO: Applications and Technology 2019 - San Jose, United States
Duration: 5 May 201910 May 2019

Conference

ConferenceCLEO: Applications and Technology 2019
CountryUnited States
CitySan Jose
Period5/05/1910/05/19

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials

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  • Cite this

    Ding, Y., Llewellyn, D., Faruque, I., Paesani, S., Bacco, D., Santagati, R., Qian, Y., Li, Y., Xiao, Y., Huber, M., Malik, M., Sinclair, G., Zhou, X., Rottwitt, K., O’Brien, J., Rarity, J., Gong, Q., Oxenlowe, L., Wang, J., & Thompson, M. (2019). Demonstration of chip-to-chip quantum teleportation. In CLEO: Applications and Technology 2019 [JTh5C.4] Optical Society of America. https://doi.org/10.1364/CLEO_AT.2019.JTh5C.4