Copper electroplating of PCB interconnects using megasonic acoustic streaming

Tom Jones, Anne Bernassau, David Flynn, Dennis Price, Matthew Beadel, Marc Phillipe Yves Desmulliez

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Abstract

In this research experimental and simulated analysis investigates the influence of megasonic (MS; 1 ± 0.05 MHz) acoustic-assisted electroplating techniques, with respect to the fabrication of through-hole via (THV) and blind-via (BV) interconnects for the Printed Circuit Board (PCB) industry. MS plating of copper down THV and BV interconnects was shown to produce measurable benefits such as increased connectivity throughout a PCB and cost savings. More specifically, a 700% increase of copper plating rate was demonstrated for THVs of 175 µm diameter and depth-to-width aspect ratio (ar) of 5.7:1, compared with electrodeposition under no-agitation conditions. For BVs, a 60% average increase in copper thickness deposition in 150 µm and 200 µm, ar 1:1, was demonstrated against plating under standard manufacturing conditions including bubble agitation and panel movement. Finite element modelling simulations of acoustic scattering revealed 1st harmonic influence for plating rate enhancement.
Original languageEnglish
Pages (from-to)434-444
Number of pages11
JournalUltrasonics Sonochemistry
Volume42
Early online date5 Dec 2017
DOIs
Publication statusPublished - Apr 2018

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