Computer modeling of the coarsening process in tin-lead solders

INIS

• computerized simulation 100%
• tin 100%
• diffusion equations 66%
• eutectics 66%
• strains 33%
• levels 33%
• weight 33%
• microstructure 33%
• modeling 33%
• volume 33%
• diffusion 33%
• surface tension 33%
• one-dimensional calculations 33%
• numerical solution 33%
• morphology 33%
• particle size 33%
• fourier transformation 33%

Engineering

• Computer Simulation 100%
• Phase Separation 66%
• Diffusion Equation 66%
• Eutectics 66%
• Microstructure 33%
• One Dimensional 33%
• Field Model 33%
• Diffusive 33%
• Experimental Observation 33%
• Tension Surface 33%
• Phase Field 33%
• Model Type 33%
• Discrete Fourier Transform 33%
• Mechanical Stress 33%
• Numerical Solution 33%
• Initial Condition 33%

Material Science

• Coarsening 100%
• Tin 100%
• Volume Fraction 33%
• Mechanical Stress 33%
• Phase Field Model 33%
• Surface Tension 33%