Computational electrohydrodynamics in the fabrication of hollow polymer microstructures

C. Tonry, M. Patel, Marc Phillipe Yves Desmulliez, W. Yu, C. Bailey

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Electric Field Assisted Capillarity is a novel process which has the potential for the fabrication of hollow polymer microstructures as a single step process. The process has been shown to work experimentally on a microscale using PDMS. The process makes use of both the electrohydrodynamics of polymers at a microscale and also the capillary force on the polymer caused by a low contact angle on a heavily wetted surface. Discussed in this paper are the results of a two-dimensional numerical simulation of the process. The results presented here are for the an angular mask producing microchannels and demonstrate how differing contact angles on the top mask effect the thickness of the top of the microstructures and also whether the fabrication of the microstructure is possible at all.

Original languageEnglish
Title of host publicationThermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on
PublisherIEEE
ISBN (Print)9781479999507
DOIs
Publication statusPublished - May 2015
Event2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Budapest, Hungary
Duration: 19 Apr 201522 Apr 2015

Conference

Conference2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Abbreviated title EuroSimE 2015
CountryHungary
CityBudapest
Period19/04/1522/04/15

Fingerprint

Electrohydrodynamics
Fabrication
Microstructure
Contact angle
Masks
Polymers
Capillarity
Microchannels
Electric fields
Computer simulation

ASJC Scopus subject areas

  • Computational Theory and Mathematics
  • Electrical and Electronic Engineering
  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering

Cite this

Tonry, C., Patel, M., Desmulliez, M. P. Y., Yu, W., & Bailey, C. (2015). Computational electrohydrodynamics in the fabrication of hollow polymer microstructures. In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on [7103153] IEEE. https://doi.org/10.1109/EuroSimE.2015.7103153
Tonry, C. ; Patel, M. ; Desmulliez, Marc Phillipe Yves ; Yu, W. ; Bailey, C. / Computational electrohydrodynamics in the fabrication of hollow polymer microstructures. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on. IEEE, 2015.
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Tonry, C, Patel, M, Desmulliez, MPY, Yu, W & Bailey, C 2015, Computational electrohydrodynamics in the fabrication of hollow polymer microstructures. in Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on., 7103153, IEEE, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Budapest, Hungary, 19/04/15. https://doi.org/10.1109/EuroSimE.2015.7103153

Computational electrohydrodynamics in the fabrication of hollow polymer microstructures. / Tonry, C.; Patel, M.; Desmulliez, Marc Phillipe Yves; Yu, W.; Bailey, C.

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on. IEEE, 2015. 7103153.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Tonry C, Patel M, Desmulliez MPY, Yu W, Bailey C. Computational electrohydrodynamics in the fabrication of hollow polymer microstructures. In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on. IEEE. 2015. 7103153 https://doi.org/10.1109/EuroSimE.2015.7103153