Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices

A. L. Bernassau, J. J. McAneny, T. McGroggan, T. W. Button, H. Hughes, C. Meggs, S. Cochran

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Ultrasound is used in more than 20% of biomedical imaging scans. Several clinical applications would benefit significantly from the higher spatial resolution offered by higher frequency operation than is presently common. A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on the surface of the piezoceramic-polymer composite material requires planar, parallel and smooth surfaces. An investigation of the surface finishing of piezocomposite material by mechanical lapping and/polishing has recently demonstrated that excellent surface flatness can be obtained. However, the use of wax mounting during the surface processing causes problems because of the required temperatures and the need to remove wax from the very fragile substrates after finishing. Conventional tape mounting cannot withstand the high lateral forces generated by the irregularly shaped samples presently produced by the composite development process. Wax-free mounting has been developed as an alternative, utilising a porous ceramic vacuum chuck incorporated within otherwise standard mechanical lapping/polishing equipment. High frequency array elements have been successfully fabricated on composite surfaces and good electrode edge definition and electrical contact to the composite have been obtained. It is expected that the use of the wax-free equipment and techniques will reduce the eventual cost and

Original languageEnglish
Title of host publication2008 IEEE/Semi Advanced Semiconductor Manufacturing Conference
Place of PublicationNew York
PublisherIEEE
Pages100-104
Number of pages5
ISBN (Print)978-1-4244-1964-7
DOIs
Publication statusPublished - 2008
EventIEEE/SEMI Advanced Semiconductor Manufacturing Conference - Cambridge, Morocco
Duration: 5 May 20087 May 2008

Publication series

NameADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP - PROCEEDINGS
PublisherIEEE
ISSN (Print)1078-8743

Conference

ConferenceIEEE/SEMI Advanced Semiconductor Manufacturing Conference
CountryMorocco
Period5/05/087/05/08

Keywords

  • substrate thinning
  • composite materials
  • piezoelectric ceramics
  • wax mounting
  • FABRICATION

Cite this

Bernassau, A. L., McAneny, J. J., McGroggan, T., Button, T. W., Hughes, H., Meggs, C., & Cochran, S. (2008). Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices. In 2008 IEEE/Semi Advanced Semiconductor Manufacturing Conference (pp. 100-104). (ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP - PROCEEDINGS). New York : IEEE. https://doi.org/10.1109/ASMC.2008.4529018
Bernassau, A. L. ; McAneny, J. J. ; McGroggan, T. ; Button, T. W. ; Hughes, H. ; Meggs, C. ; Cochran, S. / Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices. 2008 IEEE/Semi Advanced Semiconductor Manufacturing Conference . New York : IEEE, 2008. pp. 100-104 (ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP - PROCEEDINGS).
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title = "Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices",
abstract = "Ultrasound is used in more than 20{\%} of biomedical imaging scans. Several clinical applications would benefit significantly from the higher spatial resolution offered by higher frequency operation than is presently common. A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on the surface of the piezoceramic-polymer composite material requires planar, parallel and smooth surfaces. An investigation of the surface finishing of piezocomposite material by mechanical lapping and/polishing has recently demonstrated that excellent surface flatness can be obtained. However, the use of wax mounting during the surface processing causes problems because of the required temperatures and the need to remove wax from the very fragile substrates after finishing. Conventional tape mounting cannot withstand the high lateral forces generated by the irregularly shaped samples presently produced by the composite development process. Wax-free mounting has been developed as an alternative, utilising a porous ceramic vacuum chuck incorporated within otherwise standard mechanical lapping/polishing equipment. High frequency array elements have been successfully fabricated on composite surfaces and good electrode edge definition and electrical contact to the composite have been obtained. It is expected that the use of the wax-free equipment and techniques will reduce the eventual cost and",
keywords = "substrate thinning, composite materials, piezoelectric ceramics, wax mounting, FABRICATION",
author = "Bernassau, {A. L.} and McAneny, {J. J.} and T. McGroggan and Button, {T. W.} and H. Hughes and C. Meggs and S. Cochran",
year = "2008",
doi = "10.1109/ASMC.2008.4529018",
language = "English",
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series = "ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP - PROCEEDINGS",
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Bernassau, AL, McAneny, JJ, McGroggan, T, Button, TW, Hughes, H, Meggs, C & Cochran, S 2008, Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices. in 2008 IEEE/Semi Advanced Semiconductor Manufacturing Conference . ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP - PROCEEDINGS, IEEE, New York , pp. 100-104, IEEE/SEMI Advanced Semiconductor Manufacturing Conference, Morocco, 5/05/08. https://doi.org/10.1109/ASMC.2008.4529018

Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices. / Bernassau, A. L.; McAneny, J. J.; McGroggan, T.; Button, T. W.; Hughes, H.; Meggs, C.; Cochran, S.

2008 IEEE/Semi Advanced Semiconductor Manufacturing Conference . New York : IEEE, 2008. p. 100-104 (ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP - PROCEEDINGS).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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T1 - Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices

AU - Bernassau, A. L.

AU - McAneny, J. J.

AU - McGroggan, T.

AU - Button, T. W.

AU - Hughes, H.

AU - Meggs, C.

AU - Cochran, S.

PY - 2008

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N2 - Ultrasound is used in more than 20% of biomedical imaging scans. Several clinical applications would benefit significantly from the higher spatial resolution offered by higher frequency operation than is presently common. A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on the surface of the piezoceramic-polymer composite material requires planar, parallel and smooth surfaces. An investigation of the surface finishing of piezocomposite material by mechanical lapping and/polishing has recently demonstrated that excellent surface flatness can be obtained. However, the use of wax mounting during the surface processing causes problems because of the required temperatures and the need to remove wax from the very fragile substrates after finishing. Conventional tape mounting cannot withstand the high lateral forces generated by the irregularly shaped samples presently produced by the composite development process. Wax-free mounting has been developed as an alternative, utilising a porous ceramic vacuum chuck incorporated within otherwise standard mechanical lapping/polishing equipment. High frequency array elements have been successfully fabricated on composite surfaces and good electrode edge definition and electrical contact to the composite have been obtained. It is expected that the use of the wax-free equipment and techniques will reduce the eventual cost and

AB - Ultrasound is used in more than 20% of biomedical imaging scans. Several clinical applications would benefit significantly from the higher spatial resolution offered by higher frequency operation than is presently common. A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on the surface of the piezoceramic-polymer composite material requires planar, parallel and smooth surfaces. An investigation of the surface finishing of piezocomposite material by mechanical lapping and/polishing has recently demonstrated that excellent surface flatness can be obtained. However, the use of wax mounting during the surface processing causes problems because of the required temperatures and the need to remove wax from the very fragile substrates after finishing. Conventional tape mounting cannot withstand the high lateral forces generated by the irregularly shaped samples presently produced by the composite development process. Wax-free mounting has been developed as an alternative, utilising a porous ceramic vacuum chuck incorporated within otherwise standard mechanical lapping/polishing equipment. High frequency array elements have been successfully fabricated on composite surfaces and good electrode edge definition and electrical contact to the composite have been obtained. It is expected that the use of the wax-free equipment and techniques will reduce the eventual cost and

KW - substrate thinning

KW - composite materials

KW - piezoelectric ceramics

KW - wax mounting

KW - FABRICATION

U2 - 10.1109/ASMC.2008.4529018

DO - 10.1109/ASMC.2008.4529018

M3 - Conference contribution

SN - 978-1-4244-1964-7

T3 - ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP - PROCEEDINGS

SP - 100

EP - 104

BT - 2008 IEEE/Semi Advanced Semiconductor Manufacturing Conference

PB - IEEE

CY - New York

ER -

Bernassau AL, McAneny JJ, McGroggan T, Button TW, Hughes H, Meggs C et al. Comparison of wax and wax-free mounting of irregular piezocomposite materials for thinning for high-frequency medical devices. In 2008 IEEE/Semi Advanced Semiconductor Manufacturing Conference . New York : IEEE. 2008. p. 100-104. (ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP - PROCEEDINGS). https://doi.org/10.1109/ASMC.2008.4529018