@inproceedings{1e05cc765ce44c479cf010c682c50dc4,
title = "Comparison of encapsulant curing with convection and microwave systems",
abstract = "Comparison of the performance of a conventional convection oven system with a dual-section microwave system for curing thermosetting polymer encapsulant materials has been performed numerically. A numerical model capable of analysing both the convection and microwave cure processes has been developed and is briefly outlined. The model is used to analyse the curing of a commercially available encapsulant material using both systems. Results obtained from numerical solutions are presented, confirming that the VFM system enables the cure process to be carried out far more rapidly than with the convection oven system. This capability stems from the fundamental heating processes involved, namely that microwave processing enables the heating rate to be varied independently of the material temperature. Variations in cure times, curing rates, maximum temperatures and residual stresses between the processes are fully discussed.",
author = "T. Tilford and Sinclair, {K. I.} and G. Goussetis and C. Bailey and Desmulliez, {M. P Y} and Parrott, {A. K.} and Sangster, {A. J.}",
year = "2008",
doi = "10.1109/IEMT.2008.5507869",
language = "English",
isbn = "978-1-4244-3392-6",
series = "Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium",
booktitle = "Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International",
note = "2008 33rd IEEE/CPMT International Electronics Manufacturing Technology onference, IEMT 2008 ; Conference date: 04-11-2008 Through 06-11-2008",
}