Comparison of encapsulant curing with convection and microwave systems

T. Tilford, K. I. Sinclair, G. Goussetis, C. Bailey, M. P Y Desmulliez, A. K. Parrott, A. J. Sangster

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Comparison of the performance of a conventional convection oven system with a dual-section microwave system for curing thermosetting polymer encapsulant materials has been performed numerically. A numerical model capable of analysing both the convection and microwave cure processes has been developed and is briefly outlined. The model is used to analyse the curing of a commercially available encapsulant material using both systems. Results obtained from numerical solutions are presented, confirming that the VFM system enables the cure process to be carried out far more rapidly than with the convection oven system. This capability stems from the fundamental heating processes involved, namely that microwave processing enables the heating rate to be varied independently of the material temperature. Variations in cure times, curing rates, maximum temperatures and residual stresses between the processes are fully discussed.

Original languageEnglish
Title of host publicationElectronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International
Subtitle of host publication2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008; Penang; Malaysia; 4 November 2008 through 6 November 2008
ISBN (Electronic)978-1-4244-3393-3
DOIs
Publication statusPublished - 2008
Event2008 33rd IEEE/CPMT International Electronics Manufacturing Technology onference - Penang, Malaysia
Duration: 4 Nov 20086 Nov 2008

Publication series

NameProceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
ISSN (Print)1089-8190

Conference

Conference2008 33rd IEEE/CPMT International Electronics Manufacturing Technology onference
Abbreviated titleIEMT 2008
CountryMalaysia
CityPenang
Period4/11/086/11/08

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    Tilford, T., Sinclair, K. I., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K., & Sangster, A. J. (2008). Comparison of encapsulant curing with convection and microwave systems. In Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008; Penang; Malaysia; 4 November 2008 through 6 November 2008 (Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium). https://doi.org/10.1109/IEMT.2008.5507869