Compact wideband combline filter using LCP bonded multilayer PCB technology

Jia Ni*, Jiasheng Hong

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)


A novel compact wideband third-order combline filter using LCP bonded multilayer PCB technology is proposed in this letter. Thanks to the use of the proposed new multilayer technology, it not only can very conveniently realize a very strong coupling to achieve a wideband, but also can achieve more miniaturized size in comparison of the conventional design based on the LCP technology. In addition, two dissimilar quarter-wavelength stepped-impedance resonators with tapped input/output coupling were adopted in the design, which resulted in two transmission zeros in the upper stopband to improve the upper stopband performance. The predicted results are verified by the experiments, which show the fabricated filter has a 3 dB fractional bandwidth of 81% operating at 0.95GHz, 6th harmonic suppression with two transmission zeros and a very compact size of 0.153λg*0. 06λgg is the guided wavelength at the center frequency).

Original languageEnglish
Title of host publication2012 42nd European Microwave Conference
Number of pages4
ISBN (Electronic)9782874870279
ISBN (Print)9781467322157
Publication statusPublished - 11 Feb 2013
Event42nd European Microwave Conference 2012 - Amsterdam, Netherlands
Duration: 29 Oct 20121 Nov 2012


Conference42nd European Microwave Conference 2012
Abbreviated titleEuMC 2012


  • combline filter
  • multilayer filters
  • wideband filter

ASJC Scopus subject areas

  • Electrical and Electronic Engineering


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