Compact wideband combline filter using LCP bonded multilayer PCB technology

Jia Ni; Jiasheng Hong

doi:10.23919/EuMC.2012.6459376

Compact wideband combline filter using LCP bonded multilayer PCB technology

Jia Ni^*, Jiasheng Hong

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

A novel compact wideband third-order combline filter using LCP bonded multilayer PCB technology is proposed in this letter. Thanks to the use of the proposed new multilayer technology, it not only can very conveniently realize a very strong coupling to achieve a wideband, but also can achieve more miniaturized size in comparison of the conventional design based on the LCP technology. In addition, two dissimilar quarter-wavelength stepped-impedance resonators with tapped input/output coupling were adopted in the design, which resulted in two transmission zeros in the upper stopband to improve the upper stopband performance. The predicted results are verified by the experiments, which show the fabricated filter has a 3 dB fractional bandwidth of 81% operating at 0.95GHz, 6^th harmonic suppression with two transmission zeros and a very compact size of 0.153λ_g*0. 06λ_g (λ_g is the guided wavelength at the center frequency).

Original language	English
Title of host publication	2012 42nd European Microwave Conference
Publisher	IEEE
Pages	356-359
Number of pages	4
ISBN (Electronic)	9782874870279
ISBN (Print)	9781467322157
DOIs	https://doi.org/10.23919/EuMC.2012.6459376
Publication status	Published - 11 Feb 2013
Event	42nd European Microwave Conference 2012 - Amsterdam, Netherlands Duration: 29 Oct 2012 → 1 Nov 2012

Conference

Conference	42nd European Microwave Conference 2012
Abbreviated title	EuMC 2012
Country/Territory	Netherlands
City	Amsterdam
Period	29/10/12 → 1/11/12

Keywords

combline filter
multilayer filters
wideband filter

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.23919/EuMC.2012.6459376

Cite this

@inproceedings{278d0ce122af4f099cb139c547fc8f19,

title = "Compact wideband combline filter using LCP bonded multilayer PCB technology",

abstract = "A novel compact wideband third-order combline filter using LCP bonded multilayer PCB technology is proposed in this letter. Thanks to the use of the proposed new multilayer technology, it not only can very conveniently realize a very strong coupling to achieve a wideband, but also can achieve more miniaturized size in comparison of the conventional design based on the LCP technology. In addition, two dissimilar quarter-wavelength stepped-impedance resonators with tapped input/output coupling were adopted in the design, which resulted in two transmission zeros in the upper stopband to improve the upper stopband performance. The predicted results are verified by the experiments, which show the fabricated filter has a 3 dB fractional bandwidth of 81% operating at 0.95GHz, 6th harmonic suppression with two transmission zeros and a very compact size of 0.153λg*0. 06λg (λg is the guided wavelength at the center frequency).",

keywords = "combline filter, multilayer filters, wideband filter",

author = "Jia Ni and Jiasheng Hong",

year = "2013",

month = feb,

day = "11",

doi = "10.23919/EuMC.2012.6459376",

language = "English",

isbn = "9781467322157",

pages = "356--359",

booktitle = "2012 42nd European Microwave Conference",

publisher = "IEEE",

address = "United States",

note = "42nd European Microwave Conference 2012, EuMC 2012 ; Conference date: 29-10-2012 Through 01-11-2012",

}

TY - GEN

T1 - Compact wideband combline filter using LCP bonded multilayer PCB technology

AU - Ni, Jia

AU - Hong, Jiasheng

PY - 2013/2/11

Y1 - 2013/2/11

N2 - A novel compact wideband third-order combline filter using LCP bonded multilayer PCB technology is proposed in this letter. Thanks to the use of the proposed new multilayer technology, it not only can very conveniently realize a very strong coupling to achieve a wideband, but also can achieve more miniaturized size in comparison of the conventional design based on the LCP technology. In addition, two dissimilar quarter-wavelength stepped-impedance resonators with tapped input/output coupling were adopted in the design, which resulted in two transmission zeros in the upper stopband to improve the upper stopband performance. The predicted results are verified by the experiments, which show the fabricated filter has a 3 dB fractional bandwidth of 81% operating at 0.95GHz, 6th harmonic suppression with two transmission zeros and a very compact size of 0.153λg*0. 06λg (λg is the guided wavelength at the center frequency).

AB - A novel compact wideband third-order combline filter using LCP bonded multilayer PCB technology is proposed in this letter. Thanks to the use of the proposed new multilayer technology, it not only can very conveniently realize a very strong coupling to achieve a wideband, but also can achieve more miniaturized size in comparison of the conventional design based on the LCP technology. In addition, two dissimilar quarter-wavelength stepped-impedance resonators with tapped input/output coupling were adopted in the design, which resulted in two transmission zeros in the upper stopband to improve the upper stopband performance. The predicted results are verified by the experiments, which show the fabricated filter has a 3 dB fractional bandwidth of 81% operating at 0.95GHz, 6th harmonic suppression with two transmission zeros and a very compact size of 0.153λg*0. 06λg (λg is the guided wavelength at the center frequency).

KW - combline filter

KW - multilayer filters

KW - wideband filter

UR - http://www.scopus.com/inward/record.url?scp=84874601682&partnerID=8YFLogxK

U2 - 10.23919/EuMC.2012.6459376

DO - 10.23919/EuMC.2012.6459376

M3 - Conference contribution

AN - SCOPUS:84874601682

SN - 9781467322157

SP - 356

EP - 359

BT - 2012 42nd European Microwave Conference

PB - IEEE

T2 - 42nd European Microwave Conference 2012

Y2 - 29 October 2012 through 1 November 2012

ER -

Compact wideband combline filter using LCP bonded multilayer PCB technology

Abstract

Conference

Keywords

ASJC Scopus subject areas

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