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Compact high-gain mmWave antenna for TSV-based system-in-package application

  • Sanming Hu
  • , Yong-zhong Xiong
  • , Lei Wang
  • , Rui Li
  • , Jinglin Shi
  • , Teck-guan Lim

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)841-846
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume2
Issue number5
DOIs
Publication statusPublished - 3 May 2012

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