Compact high-gain mmWave antenna for TSV-based system-in-package application

Sanming Hu, Yong-zhong Xiong, Lei Wang, Rui Li, Jinglin Shi, Teck-guan Lim

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	841-846
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	2
Issue number	5
DOIs	https://doi.org/10.1109/TCPMT.2012.2188293
Publication status	Published - 3 May 2012

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@article{522b42d2c56b4a949ed038bbbf8a31e5,

title = "Compact high-gain mmWave antenna for TSV-based system-in-package application",

author = "Sanming Hu and Yong-zhong Xiong and Lei Wang and Rui Li and Jinglin Shi and Teck-guan Lim",

year = "2012",

month = may,

day = "3",

doi = "10.1109/TCPMT.2012.2188293",

language = "English",

volume = "2",

pages = "841--846",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

issn = "2156-3950",

publisher = "IEEE",

number = "5",

}

TY - JOUR

T1 - Compact high-gain mmWave antenna for TSV-based system-in-package application

AU - Hu, Sanming

AU - Xiong, Yong-zhong

AU - Wang, Lei

AU - Li, Rui

AU - Shi, Jinglin

AU - Lim, Teck-guan

PY - 2012/5/3

Y1 - 2012/5/3

UR - https://www.scopus.com/pages/publications/84860881931

U2 - 10.1109/TCPMT.2012.2188293

DO - 10.1109/TCPMT.2012.2188293

M3 - Article

SN - 2156-3950

VL - 2

SP - 841

EP - 846

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

IS - 5

ER -