Compact high-gain mmWave antenna for TSV-based system-in-package application

Sanming Hu, Yong-zhong Xiong, Lei Wang, Rui Li, Jinglin Shi, Teck-guan Lim

Research output: Contribution to journalArticle

18 Citations (Scopus)
Original languageEnglish
Pages (from-to)841-846
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume2
Issue number5
DOIs
Publication statusPublished - 3 May 2012

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