Chip-to-chip quantum photonic interconnect by path-polarization interconversion

Jianwei Wang, Damien Bonneau, Matteo Villa, Joshua W. Silverstone, Raffaele Santagati, Shigehito Miki, Taro Yamashita, Mikio Fujiwara, Masahide Sasaki, Hirotaka Terai, Michael G. Tanner, Chandra M Natarajan, Robert H Hadfield, Jeremy L. O’Brien, Mark G. Thompson

Research output: Contribution to journalArticle

Abstract

Integrated photonics has enabled much progress toward quantum technologies. Many applications, e.g., quantum communication, sensing, and distributed cloud quantum computing, require coherent photonic interconnection between separate on-chip subsystems. Large-scale quantum computing architectures and systems may ultimately require quantum interconnects to enable scaling beyond the limits of a single wafer, and toward multi-chip systems. However, coherently connecting separate chips remains a challenge, due to the fragility of entangled quantum states. The distribution and manipulation of entanglement between multiple integrated devices is one of the strictest requirements of these systems. Here, we report, to the best of our knowledge, the first quantum photonic interconnect, demonstrating high-fidelity entanglement distribution and manipulation between two separate photonic chips, implemented using state-of-the-art silicon photonics. Path-entangled states are generated on one chip, and distributed to another chip by interconverting between path and polarization degrees of freedom, via a two-dimensional grating coupler on each chip. This path-to-polarization conversion allows entangled quantum states to be coherently distributed. We use integrated state analyzers to confirm a Bell-type violation of 푆=2.638±0.039 between the two chips. With further improvements in loss, this quantum photonic interconnect will provide new levels of flexibility in quantum systems and architectures.
Original languageEnglish
Pages (from-to)407-413
Number of pages7
JournalOptica
Volume3
Issue number4
DOIs
Publication statusPublished - 20 Apr 2016

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chips
photonics
polarization
quantum computation
manipulators
quantum communication
bells
couplers
analyzers
flexibility
degrees of freedom
wafers
gratings
scaling
requirements
silicon

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Wang, J., Bonneau, D., Villa, M., Silverstone, J. W., Santagati, R., Miki, S., ... Thompson, M. G. (2016). Chip-to-chip quantum photonic interconnect by path-polarization interconversion. Optica, 3(4), 407-413. https://doi.org/10.1364/OPTICA.3.000407
Wang, Jianwei ; Bonneau, Damien ; Villa, Matteo ; Silverstone, Joshua W. ; Santagati, Raffaele ; Miki, Shigehito ; Yamashita, Taro ; Fujiwara, Mikio ; Sasaki, Masahide ; Terai, Hirotaka ; Tanner, Michael G. ; Natarajan, Chandra M ; Hadfield, Robert H ; O’Brien, Jeremy L. ; Thompson, Mark G. / Chip-to-chip quantum photonic interconnect by path-polarization interconversion. In: Optica. 2016 ; Vol. 3, No. 4. pp. 407-413.
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Wang, J, Bonneau, D, Villa, M, Silverstone, JW, Santagati, R, Miki, S, Yamashita, T, Fujiwara, M, Sasaki, M, Terai, H, Tanner, MG, Natarajan, CM, Hadfield, RH, O’Brien, JL & Thompson, MG 2016, 'Chip-to-chip quantum photonic interconnect by path-polarization interconversion', Optica, vol. 3, no. 4, pp. 407-413. https://doi.org/10.1364/OPTICA.3.000407

Chip-to-chip quantum photonic interconnect by path-polarization interconversion. / Wang, Jianwei; Bonneau, Damien; Villa, Matteo; Silverstone, Joshua W.; Santagati, Raffaele; Miki, Shigehito; Yamashita, Taro; Fujiwara, Mikio; Sasaki, Masahide; Terai, Hirotaka; Tanner, Michael G.; Natarajan, Chandra M; Hadfield, Robert H; O’Brien, Jeremy L.; Thompson, Mark G.

In: Optica, Vol. 3, No. 4, 20.04.2016, p. 407-413.

Research output: Contribution to journalArticle

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AU - Wang, Jianwei

AU - Bonneau, Damien

AU - Villa, Matteo

AU - Silverstone, Joshua W.

AU - Santagati, Raffaele

AU - Miki, Shigehito

AU - Yamashita, Taro

AU - Fujiwara, Mikio

AU - Sasaki, Masahide

AU - Terai, Hirotaka

AU - Tanner, Michael G.

AU - Natarajan, Chandra M

AU - Hadfield, Robert H

AU - O’Brien, Jeremy L.

AU - Thompson, Mark G.

PY - 2016/4/20

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N2 - Integrated photonics has enabled much progress toward quantum technologies. Many applications, e.g., quantum communication, sensing, and distributed cloud quantum computing, require coherent photonic interconnection between separate on-chip subsystems. Large-scale quantum computing architectures and systems may ultimately require quantum interconnects to enable scaling beyond the limits of a single wafer, and toward multi-chip systems. However, coherently connecting separate chips remains a challenge, due to the fragility of entangled quantum states. The distribution and manipulation of entanglement between multiple integrated devices is one of the strictest requirements of these systems. Here, we report, to the best of our knowledge, the first quantum photonic interconnect, demonstrating high-fidelity entanglement distribution and manipulation between two separate photonic chips, implemented using state-of-the-art silicon photonics. Path-entangled states are generated on one chip, and distributed to another chip by interconverting between path and polarization degrees of freedom, via a two-dimensional grating coupler on each chip. This path-to-polarization conversion allows entangled quantum states to be coherently distributed. We use integrated state analyzers to confirm a Bell-type violation of 푆=2.638±0.039 between the two chips. With further improvements in loss, this quantum photonic interconnect will provide new levels of flexibility in quantum systems and architectures.

AB - Integrated photonics has enabled much progress toward quantum technologies. Many applications, e.g., quantum communication, sensing, and distributed cloud quantum computing, require coherent photonic interconnection between separate on-chip subsystems. Large-scale quantum computing architectures and systems may ultimately require quantum interconnects to enable scaling beyond the limits of a single wafer, and toward multi-chip systems. However, coherently connecting separate chips remains a challenge, due to the fragility of entangled quantum states. The distribution and manipulation of entanglement between multiple integrated devices is one of the strictest requirements of these systems. Here, we report, to the best of our knowledge, the first quantum photonic interconnect, demonstrating high-fidelity entanglement distribution and manipulation between two separate photonic chips, implemented using state-of-the-art silicon photonics. Path-entangled states are generated on one chip, and distributed to another chip by interconverting between path and polarization degrees of freedom, via a two-dimensional grating coupler on each chip. This path-to-polarization conversion allows entangled quantum states to be coherently distributed. We use integrated state analyzers to confirm a Bell-type violation of 푆=2.638±0.039 between the two chips. With further improvements in loss, this quantum photonic interconnect will provide new levels of flexibility in quantum systems and architectures.

U2 - 10.1364/OPTICA.3.000407

DO - 10.1364/OPTICA.3.000407

M3 - Article

VL - 3

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EP - 413

JO - Optica

JF - Optica

SN - 2334-2536

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Wang J, Bonneau D, Villa M, Silverstone JW, Santagati R, Miki S et al. Chip-to-chip quantum photonic interconnect by path-polarization interconversion. Optica. 2016 Apr 20;3(4):407-413. https://doi.org/10.1364/OPTICA.3.000407