Chip scale studies of BCB based polymer bonding for MEMS packaging

C. H. Wang, J. Zeng, K. Zhao, H. L. Chan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

16 Citations (Scopus)

Abstract

This paper presents chip scale investigation of polymer based bonding processes for producing microcavities for encapsulation of MEMS and other microscale devices. The polymer sealing rings were fabricated on the glass covers using the photosensitive BCB polymer and photolithography. They were bonded onto a variety of substrates including silicon substrates, aluminum coated substrates and glass substrates with feedthrough structures to investigate the properties of polymer bonding under different conditions. A high-yield BCB bonding procedure was established. For hotplate based bonding, a pre-bonding step is essential to ensure defect-free polymer seal. The optimized bonding process requires pre-bonding at 150°C for 5 minutes followed by final bonding at 250°C for 15 minutes. The capability of sealing feedthrough structures on a substrate of the BCB polymer was demonstrated using 0.5 µm thick titanium line structures. Fast bonding using laser assisted curing was achieved in less than 10 seconds, representing a factor of ~100 of improvement over the hotplate based approach. The quality of the polymer seal was evaluated using optical inspection and leak and shear tests. © 2008 IEEE.

Original languageEnglish
Title of host publication2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
Pages1869-1873
Number of pages5
DOIs
Publication statusPublished - 2008
Event58th Electronic Components and Technology Conference - Lake Buena Vista, FL, United States
Duration: 27 May 200830 May 2008

Conference

Conference58th Electronic Components and Technology Conference
Abbreviated titleECTC
CountryUnited States
CityLake Buena Vista, FL
Period27/05/0830/05/08

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