@inproceedings{6f204f1d66e343ecbdb42fc984551169,
title = "Characterizations of physical properties of Sn-Bi solder alloy",
abstract = "As the electronic packaging industry is vastly being developed, the solder plays a crucial role in providing integrity electronic assemblies. Unfortunately, the traditional Sn-Pb solder is harmful to the environment and human due to lead (Pb) it contains. Hence, in this study, the Sn-Bi lead free solder alloy is investigated based on its physical properties together with melting temperature, hardness and microstructure. Investigation shows that this solder provides a low melting temperature of, Tm=141.08°C which is lower than the most used Sn-Pb, Tm=183°C and Sn-Ag-Cu, Tm=227°C. Moreover, the Sn-Bi solder also produces well-defined microstructures with Sn-matrix and bismuth precipitation on the matrix. The Sn-Bi solder also provides a higher hardness with average of 11.8Hv for Vickers hardness and 3.87BHN for Brinell hardness. All this results seem to satisfies the environment as well as producing better physical properties.",
keywords = "Alloy, Microstructure, Sn-Bi, Solder",
author = "S. Amares and {Ervina Efzan}, {M. N.} and Yap, {Tze Chuen}",
year = "2014",
doi = "10.4028/www.scientific.net/AMR.845.261",
language = "English",
isbn = "9783037859360",
series = "Advanced Materials Research",
publisher = "Trans Tech Publications",
pages = "261--265",
editor = "Denni Kurniawan",
booktitle = "Materials, Industrial, and Manufacturing Engineering Research Advances 1.1",
address = "Germany",
note = "1st International Materials, Industrial, and Manufacturing Engineering Conference 2013, MIMEC 2013 ; Conference date: 04-12-2013 Through 06-12-2013",
}