Characterizations of physical properties of Sn-Bi solder alloy

S. Amares, M. N. Ervina Efzan, Tze Chuen Yap

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

As the electronic packaging industry is vastly being developed, the solder plays a crucial role in providing integrity electronic assemblies. Unfortunately, the traditional Sn-Pb solder is harmful to the environment and human due to lead (Pb) it contains. Hence, in this study, the Sn-Bi lead free solder alloy is investigated based on its physical properties together with melting temperature, hardness and microstructure. Investigation shows that this solder provides a low melting temperature of, Tm=141.08°C which is lower than the most used Sn-Pb, Tm=183°C and Sn-Ag-Cu, Tm=227°C. Moreover, the Sn-Bi solder also produces well-defined microstructures with Sn-matrix and bismuth precipitation on the matrix. The Sn-Bi solder also provides a higher hardness with average of 11.8Hv for Vickers hardness and 3.87BHN for Brinell hardness. All this results seem to satisfies the environment as well as producing better physical properties.

Original languageEnglish
Title of host publicationMaterials, Industrial, and Manufacturing Engineering Research Advances 1.1
EditorsDenni Kurniawan
PublisherTrans Tech Publications
Pages261-265
Number of pages5
ISBN (Print)9783037859360
DOIs
Publication statusPublished - 2014
Event1st International Materials, Industrial, and Manufacturing Engineering Conference 2013 - Johor Bahru, Malaysia
Duration: 4 Dec 20136 Dec 2013

Publication series

NameAdvanced Materials Research
PublisherTrans Tech Publications
Volume845
ISSN (Print)1022-6680
ISSN (Electronic)1662-8985

Conference

Conference1st International Materials, Industrial, and Manufacturing Engineering Conference 2013
Abbreviated titleMIMEC 2013
CountryMalaysia
CityJohor Bahru
Period4/12/136/12/13

Fingerprint

Soldering alloys
Physical properties
Hardness
Melting point
Microstructure
Electronics packaging
Vickers hardness
Bismuth
Lead
Industry

Keywords

  • Alloy
  • Microstructure
  • Sn-Bi
  • Solder

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Amares, S., Ervina Efzan, M. N., & Yap, T. C. (2014). Characterizations of physical properties of Sn-Bi solder alloy. In D. Kurniawan (Ed.), Materials, Industrial, and Manufacturing Engineering Research Advances 1.1 (pp. 261-265). (Advanced Materials Research; Vol. 845). Trans Tech Publications. https://doi.org/10.4028/www.scientific.net/AMR.845.261
Amares, S. ; Ervina Efzan, M. N. ; Yap, Tze Chuen. / Characterizations of physical properties of Sn-Bi solder alloy. Materials, Industrial, and Manufacturing Engineering Research Advances 1.1. editor / Denni Kurniawan. Trans Tech Publications, 2014. pp. 261-265 (Advanced Materials Research).
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Amares, S, Ervina Efzan, MN & Yap, TC 2014, Characterizations of physical properties of Sn-Bi solder alloy. in D Kurniawan (ed.), Materials, Industrial, and Manufacturing Engineering Research Advances 1.1. Advanced Materials Research, vol. 845, Trans Tech Publications, pp. 261-265, 1st International Materials, Industrial, and Manufacturing Engineering Conference 2013, Johor Bahru, Malaysia, 4/12/13. https://doi.org/10.4028/www.scientific.net/AMR.845.261

Characterizations of physical properties of Sn-Bi solder alloy. / Amares, S.; Ervina Efzan, M. N.; Yap, Tze Chuen.

Materials, Industrial, and Manufacturing Engineering Research Advances 1.1. ed. / Denni Kurniawan. Trans Tech Publications, 2014. p. 261-265 (Advanced Materials Research; Vol. 845).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Amares S, Ervina Efzan MN, Yap TC. Characterizations of physical properties of Sn-Bi solder alloy. In Kurniawan D, editor, Materials, Industrial, and Manufacturing Engineering Research Advances 1.1. Trans Tech Publications. 2014. p. 261-265. (Advanced Materials Research). https://doi.org/10.4028/www.scientific.net/AMR.845.261