Characterization of Cu-Sn SLID interconnects for harsh environment applications

A. Campos-Zatarain*, D. Flynn, K. E. Aasmundtveit, N. Hoivik, K. Wang, H. Liu, T. T. Luu, M. Mirgkizoudi, R. W. Kay

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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