Abstract
This paper reports on the results obtained from performing 'shake and bake' testing on demonstrator vehicles bonded using Cu-Sn SLID technique. The demonstrator vehicles were exposed concurrently to vibration and thermal loadings similar to those seen in aerospace and downhole applications. This work demonstrates that Cu-Sn SLID bonding process is ideal for packaging sensors and electronics to be used within harsh environments, especially those encountered in the aerospace and oil & gas industries.
Original language | English |
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Title of host publication | DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS |
Publisher | IEEE |
ISBN (Print) | 9782355000287 |
DOIs | |
Publication status | Published - 2014 |
Event | 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Cannes, United Kingdom Duration: 2 Apr 2014 → 4 Apr 2014 |
Conference
Conference | 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS |
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Abbreviated title | DTIP 2014 |
Country/Territory | United Kingdom |
City | Cannes |
Period | 2/04/14 → 4/04/14 |
Keywords
- 'shake and bake'
- bonding
- Cu-Sn
- harsh environment
- high-temperature
- SLID