This paper reports on the results obtained from performing 'shake and bake' testing on demonstrator vehicles bonded using Cu-Sn SLID technique. The demonstrator vehicles were exposed concurrently to vibration and thermal loadings similar to those seen in aerospace and downhole applications. This work demonstrates that Cu-Sn SLID bonding process is ideal for packaging sensors and electronics to be used within harsh environments, especially those encountered in the aerospace and oil & gas industries.
|Title of host publication||DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS|
|Publication status||Published - 2014|
|Event||2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Cannes, United Kingdom|
Duration: 2 Apr 2014 → 4 Apr 2014
|Conference||2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS|
|Abbreviated title||DTIP 2014|
|Period||2/04/14 → 4/04/14|
- 'shake and bake'
- harsh environment