Characterization of Cu-Sn SLID interconnects for harsh environment applications

A. Campos-Zatarain, D. Flynn, K. E. Aasmundtveit, N. Hoivik, K. Wang, H. Liu, T. T. Luu, M. Mirgkizoudi, R. W. Kay

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports on the results obtained from performing 'shake and bake' testing on demonstrator vehicles bonded using Cu-Sn SLID technique. The demonstrator vehicles were exposed concurrently to vibration and thermal loadings similar to those seen in aerospace and downhole applications. This work demonstrates that Cu-Sn SLID bonding process is ideal for packaging sensors and electronics to be used within harsh environments, especially those encountered in the aerospace and oil & gas industries.

Original languageEnglish
Title of host publicationDTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
PublisherIEEE
ISBN (Print)9782355000287
DOIs
Publication statusPublished - 2014
Event2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Cannes, United Kingdom
Duration: 2 Apr 20144 Apr 2014

Conference

Conference2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Abbreviated titleDTIP 2014
CountryUnited Kingdom
CityCannes
Period2/04/144/04/14

Keywords

  • 'shake and bake'
  • bonding
  • Cu-Sn
  • harsh environment
  • high-temperature
  • SLID

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  • Cite this

    Campos-Zatarain, A., Flynn, D., Aasmundtveit, K. E., Hoivik, N., Wang, K., Liu, H., Luu, T. T., Mirgkizoudi, M., & Kay, R. W. (2014). Characterization of Cu-Sn SLID interconnects for harsh environment applications. In DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS [7056665] IEEE. https://doi.org/10.1109/DTIP.2014.7056665