Characterization of Cu-Sn SLID interconnects for harsh environment applications

A. Campos-Zatarain, D. Flynn, K. E. Aasmundtveit, N. Hoivik, K. Wang, H. Liu, T. T. Luu, M. Mirgkizoudi, R. W. Kay

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports on the results obtained from performing 'shake and bake' testing on demonstrator vehicles bonded using Cu-Sn SLID technique. The demonstrator vehicles were exposed concurrently to vibration and thermal loadings similar to those seen in aerospace and downhole applications. This work demonstrates that Cu-Sn SLID bonding process is ideal for packaging sensors and electronics to be used within harsh environments, especially those encountered in the aerospace and oil & gas industries.

Original languageEnglish
Title of host publicationDTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
PublisherIEEE
ISBN (Print)9782355000287
DOIs
Publication statusPublished - 2014
Event2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Cannes, United Kingdom
Duration: 2 Apr 20144 Apr 2014

Conference

Conference2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Abbreviated titleDTIP 2014
CountryUnited Kingdom
CityCannes
Period2/04/144/04/14

Fingerprint

Gas industry
Packaging
Electronic equipment
Sensors
Testing
Hot Temperature
Oils

Keywords

  • 'shake and bake'
  • bonding
  • Cu-Sn
  • harsh environment
  • high-temperature
  • SLID

Cite this

Campos-Zatarain, A., Flynn, D., Aasmundtveit, K. E., Hoivik, N., Wang, K., Liu, H., ... Kay, R. W. (2014). Characterization of Cu-Sn SLID interconnects for harsh environment applications. In DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS [7056665] IEEE. https://doi.org/10.1109/DTIP.2014.7056665
Campos-Zatarain, A. ; Flynn, D. ; Aasmundtveit, K. E. ; Hoivik, N. ; Wang, K. ; Liu, H. ; Luu, T. T. ; Mirgkizoudi, M. ; Kay, R. W. / Characterization of Cu-Sn SLID interconnects for harsh environment applications. DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. IEEE, 2014.
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title = "Characterization of Cu-Sn SLID interconnects for harsh environment applications",
abstract = "This paper reports on the results obtained from performing 'shake and bake' testing on demonstrator vehicles bonded using Cu-Sn SLID technique. The demonstrator vehicles were exposed concurrently to vibration and thermal loadings similar to those seen in aerospace and downhole applications. This work demonstrates that Cu-Sn SLID bonding process is ideal for packaging sensors and electronics to be used within harsh environments, especially those encountered in the aerospace and oil & gas industries.",
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author = "A. Campos-Zatarain and D. Flynn and Aasmundtveit, {K. E.} and N. Hoivik and K. Wang and H. Liu and Luu, {T. T.} and M. Mirgkizoudi and Kay, {R. W.}",
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Campos-Zatarain, A, Flynn, D, Aasmundtveit, KE, Hoivik, N, Wang, K, Liu, H, Luu, TT, Mirgkizoudi, M & Kay, RW 2014, Characterization of Cu-Sn SLID interconnects for harsh environment applications. in DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS., 7056665, IEEE, 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Cannes, United Kingdom, 2/04/14. https://doi.org/10.1109/DTIP.2014.7056665

Characterization of Cu-Sn SLID interconnects for harsh environment applications. / Campos-Zatarain, A.; Flynn, D.; Aasmundtveit, K. E.; Hoivik, N.; Wang, K.; Liu, H.; Luu, T. T.; Mirgkizoudi, M.; Kay, R. W.

DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. IEEE, 2014. 7056665.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Characterization of Cu-Sn SLID interconnects for harsh environment applications

AU - Campos-Zatarain, A.

AU - Flynn, D.

AU - Aasmundtveit, K. E.

AU - Hoivik, N.

AU - Wang, K.

AU - Liu, H.

AU - Luu, T. T.

AU - Mirgkizoudi, M.

AU - Kay, R. W.

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N2 - This paper reports on the results obtained from performing 'shake and bake' testing on demonstrator vehicles bonded using Cu-Sn SLID technique. The demonstrator vehicles were exposed concurrently to vibration and thermal loadings similar to those seen in aerospace and downhole applications. This work demonstrates that Cu-Sn SLID bonding process is ideal for packaging sensors and electronics to be used within harsh environments, especially those encountered in the aerospace and oil & gas industries.

AB - This paper reports on the results obtained from performing 'shake and bake' testing on demonstrator vehicles bonded using Cu-Sn SLID technique. The demonstrator vehicles were exposed concurrently to vibration and thermal loadings similar to those seen in aerospace and downhole applications. This work demonstrates that Cu-Sn SLID bonding process is ideal for packaging sensors and electronics to be used within harsh environments, especially those encountered in the aerospace and oil & gas industries.

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KW - bonding

KW - Cu-Sn

KW - harsh environment

KW - high-temperature

KW - SLID

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DO - 10.1109/DTIP.2014.7056665

M3 - Conference contribution

SN - 9782355000287

BT - DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

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Campos-Zatarain A, Flynn D, Aasmundtveit KE, Hoivik N, Wang K, Liu H et al. Characterization of Cu-Sn SLID interconnects for harsh environment applications. In DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. IEEE. 2014. 7056665 https://doi.org/10.1109/DTIP.2014.7056665