Characterization of Cu-Sn SLID interconnects for harsh environment applications

A. Campos-Zatarain; D. Flynn; K. E. Aasmundtveit; N. Hoivik; K. Wang; H. Liu; T. T. Luu; M. Mirgkizoudi; R. W. Kay

doi:10.1109/DTIP.2014.7056665

Characterization of Cu-Sn SLID interconnects for harsh environment applications

A. Campos-Zatarain^*, D. Flynn, K. E. Aasmundtveit, N. Hoivik, K. Wang, H. Liu, T. T. Luu, M. Mirgkizoudi, R. W. Kay

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper reports on the results obtained from performing 'shake and bake' testing on demonstrator vehicles bonded using Cu-Sn SLID technique. The demonstrator vehicles were exposed concurrently to vibration and thermal loadings similar to those seen in aerospace and downhole applications. This work demonstrates that Cu-Sn SLID bonding process is ideal for packaging sensors and electronics to be used within harsh environments, especially those encountered in the aerospace and oil & gas industries.

Original language	English
Title of host publication	DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Publisher	IEEE
ISBN (Print)	9782355000287
DOIs	https://doi.org/10.1109/DTIP.2014.7056665
Publication status	Published - 2014
Event	2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Cannes, United Kingdom Duration: 2 Apr 2014 → 4 Apr 2014

Conference

Conference	2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Abbreviated title	DTIP 2014
Country/Territory	United Kingdom
City	Cannes
Period	2/04/14 → 4/04/14

Keywords

'shake and bake'
bonding
Cu-Sn
harsh environment
high-temperature
SLID

Access to Document

10.1109/DTIP.2014.7056665

Cite this

@inproceedings{bccf9ccbe69241f49d7830390b841359,

title = "Characterization of Cu-Sn SLID interconnects for harsh environment applications",

abstract = "This paper reports on the results obtained from performing 'shake and bake' testing on demonstrator vehicles bonded using Cu-Sn SLID technique. The demonstrator vehicles were exposed concurrently to vibration and thermal loadings similar to those seen in aerospace and downhole applications. This work demonstrates that Cu-Sn SLID bonding process is ideal for packaging sensors and electronics to be used within harsh environments, especially those encountered in the aerospace and oil & gas industries.",

keywords = "'shake and bake', bonding, Cu-Sn, harsh environment, high-temperature, SLID",

author = "A. Campos-Zatarain and D. Flynn and Aasmundtveit, {K. E.} and N. Hoivik and K. Wang and H. Liu and Luu, {T. T.} and M. Mirgkizoudi and Kay, {R. W.}",

year = "2014",

doi = "10.1109/DTIP.2014.7056665",

language = "English",

isbn = "9782355000287",

booktitle = "DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS",

publisher = "IEEE",

address = "United States",

note = "2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2014 ; Conference date: 02-04-2014 Through 04-04-2014",

}

Campos-Zatarain, A, Flynn, D, Aasmundtveit, KE, Hoivik, N, Wang, K, Liu, H, Luu, TT, Mirgkizoudi, M & Kay, RW 2014, Characterization of Cu-Sn SLID interconnects for harsh environment applications. in DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS., 7056665, IEEE, 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Cannes, United Kingdom, 2/04/14. https://doi.org/10.1109/DTIP.2014.7056665

TY - GEN

T1 - Characterization of Cu-Sn SLID interconnects for harsh environment applications

AU - Campos-Zatarain, A.

AU - Flynn, D.

AU - Aasmundtveit, K. E.

AU - Hoivik, N.

AU - Wang, K.

AU - Liu, H.

AU - Luu, T. T.

AU - Mirgkizoudi, M.

AU - Kay, R. W.

PY - 2014

Y1 - 2014

N2 - This paper reports on the results obtained from performing 'shake and bake' testing on demonstrator vehicles bonded using Cu-Sn SLID technique. The demonstrator vehicles were exposed concurrently to vibration and thermal loadings similar to those seen in aerospace and downhole applications. This work demonstrates that Cu-Sn SLID bonding process is ideal for packaging sensors and electronics to be used within harsh environments, especially those encountered in the aerospace and oil & gas industries.

AB - This paper reports on the results obtained from performing 'shake and bake' testing on demonstrator vehicles bonded using Cu-Sn SLID technique. The demonstrator vehicles were exposed concurrently to vibration and thermal loadings similar to those seen in aerospace and downhole applications. This work demonstrates that Cu-Sn SLID bonding process is ideal for packaging sensors and electronics to be used within harsh environments, especially those encountered in the aerospace and oil & gas industries.

KW - 'shake and bake'

KW - bonding

KW - Cu-Sn

KW - harsh environment

KW - high-temperature

KW - SLID

U2 - 10.1109/DTIP.2014.7056665

DO - 10.1109/DTIP.2014.7056665

M3 - Conference contribution

SN - 9782355000287

BT - DTIP 2014 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

PB - IEEE

T2 - 2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Y2 - 2 April 2014 through 4 April 2014

ER -

Characterization of Cu-Sn SLID interconnects for harsh environment applications

Abstract

Conference

Keywords

Access to Document

Fingerprint

Cite this