Characterization of a photosensitive dry adhesive film for wafer level MEMS packaging

Kun Zhao, Changhai Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In this paper we present the results of initial studies of a new dry film polymer, PerMX developed by Du Pont for wafer level packaging applications. PerMX is a high resolution permanent photosensitive dry film material with low temperature processing capability. Dry film is easy to deposit on large wafers compared to the liquid form materials. We have carried out initial chip scale characterization of the material for MEMS packaging applications. A PerMX film of thickness of 20 µm was used to create sealing rings on glass wafers. The outer dimensions of the polymer rings are 5mmx5mm with a track width of 100 µm or 400 µm. Glass substrates with a polymer ring were bonded to polished silicon chips for investigation of the polymer as a bonding material for MEMS packaging. A range of bonding parameters was studied in order to obtain high bond quality. Shear test and gross leak test were conducted to evaluate the bond strengthen and hermeticity. The results show that the PerMX polymer can produce a strong bond between the glass and silicon substrates. Bond strengths of ~7 kgf have been obtained for the samples with a bonding track width of 100 µm. The samples produced under the optimal bonding conditions passed the gross leak test. In addition the surface roughness was also measured and it is less than 60 nm. These results show that the PerMX is a potentially suitable material for MEMS packaging applications. ©2009 IEEE.

Original languageEnglish
Title of host publication2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Pages485-489
Number of pages5
DOIs
Publication statusPublished - 2009
Event2009 International Conference on Electronic Packaging Technology and High Density Packaging - Beijing, China
Duration: 10 Aug 200913 Aug 2009

Conference

Conference2009 International Conference on Electronic Packaging Technology and High Density Packaging
Abbreviated titleICEPT-HDP 2009
CountryChina
CityBeijing
Period10/08/0913/08/09

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  • Cite this

    Zhao, K., & Wang, C. (2009). Characterization of a photosensitive dry adhesive film for wafer level MEMS packaging. In 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 (pp. 485-489) https://doi.org/10.1109/ICEPT.2009.5270703