Characterisation of Residual Stress in Dielectric Films Studied by Automated Wafer Mapping

Marc Phillipe Yves Desmulliez, Ruth Walker, J G Terry, G. Schiavone, Andrew R Mount, A J Walton

Research output: Contribution to conferencePaper

2 Citations (Scopus)
233 Downloads (Pure)

Abstract

SU-8 is a negative epoxy based photoresist, which is widely used as a structural and dielectric layer in the fabrication of MEMS devices. However this material normally develops high levels of stress during processing. This paper reports detailed quantitative data following previous work, where Parylene-C has been proposed as a possible replacement for SU-8. In particular, this paper details the characterisation of residual stress in (i) SU-8 films as a function of processing temperatures and (ii) post-processing thermal treatment of Parylene-C. This characterisation includes wafer mapping strain using rotating pointer arm test structures, and deriving the stress from independent measurements of strain and Young’s modulus
Original languageEnglish
Pages98-103
Publication statusPublished - 2014
Event27th International Conference on Microelectronic Test Structures - Udine, United Kingdom
Duration: 24 Mar 201427 Mar 2014

Conference

Conference27th International Conference on Microelectronic Test Structures
Abbreviated titleICMTS 2014
CountryUnited Kingdom
CityUdine
Period24/03/1427/03/14

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