Characterisation of Residual Stress in Dielectric Films Studied by Automated Wafer Mapping

Marc Phillipe Yves Desmulliez; Ruth Walker; J G Terry; G. Schiavone; Andrew R Mount; A J Walton

Characterisation of Residual Stress in Dielectric Films Studied by Automated Wafer Mapping

Marc Phillipe Yves Desmulliez, Ruth Walker, J G Terry, G. Schiavone, Andrew R Mount, A J Walton

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Abstract

SU-8 is a negative epoxy based photoresist, which is widely used as a structural and dielectric layer in the fabrication of MEMS devices. However this material normally develops high levels of stress during processing. This paper reports detailed quantitative data following previous work, where Parylene-C has been proposed as a possible replacement for SU-8. In particular, this paper details the characterisation of residual stress in (i) SU-8 films as a function of processing temperatures and (ii) post-processing thermal treatment of Parylene-C. This characterisation includes wafer mapping strain using rotating pointer arm test structures, and deriving the stress from independent measurements of strain and Young’s modulus

Original language	English
Pages	98-103
Publication status	Published - 2014
Event	27th International Conference on Microelectronic Test Structures - Udine, United Kingdom Duration: 24 Mar 2014 → 27 Mar 2014

Conference

Conference	27th International Conference on Microelectronic Test Structures
Abbreviated title	ICMTS 2014
Country/Territory	United Kingdom
City	Udine
Period	24/03/14 → 27/03/14

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@conference{00c32842574f4a6aab018c87d7233959,

title = "Characterisation of Residual Stress in Dielectric Films Studied by Automated Wafer Mapping",

abstract = "SU-8 is a negative epoxy based photoresist, which is widely used as a structural and dielectric layer in the fabrication of MEMS devices. However this material normally develops high levels of stress during processing. This paper reports detailed quantitative data following previous work, where Parylene-C has been proposed as a possible replacement for SU-8. In particular, this paper details the characterisation of residual stress in (i) SU-8 films as a function of processing temperatures and (ii) post-processing thermal treatment of Parylene-C. This characterisation includes wafer mapping strain using rotating pointer arm test structures, and deriving the stress from independent measurements of strain and Young{\textquoteright}s modulus",

author = "Desmulliez, {Marc Phillipe Yves} and Ruth Walker and Terry, {J G} and G. Schiavone and Mount, {Andrew R} and Walton, {A J}",

year = "2014",

language = "English",

pages = "98--103",

note = "27th International Conference on Microelectronic Test Structures, ICMTS 2014 ; Conference date: 24-03-2014 Through 27-03-2014",

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TY - CONF

T1 - Characterisation of Residual Stress in Dielectric Films Studied by Automated Wafer Mapping

AU - Desmulliez, Marc Phillipe Yves

AU - Walker, Ruth

AU - Terry, J G

AU - Schiavone, G.

AU - Mount, Andrew R

AU - Walton, A J

PY - 2014

Y1 - 2014

N2 - SU-8 is a negative epoxy based photoresist, which is widely used as a structural and dielectric layer in the fabrication of MEMS devices. However this material normally develops high levels of stress during processing. This paper reports detailed quantitative data following previous work, where Parylene-C has been proposed as a possible replacement for SU-8. In particular, this paper details the characterisation of residual stress in (i) SU-8 films as a function of processing temperatures and (ii) post-processing thermal treatment of Parylene-C. This characterisation includes wafer mapping strain using rotating pointer arm test structures, and deriving the stress from independent measurements of strain and Young’s modulus

AB - SU-8 is a negative epoxy based photoresist, which is widely used as a structural and dielectric layer in the fabrication of MEMS devices. However this material normally develops high levels of stress during processing. This paper reports detailed quantitative data following previous work, where Parylene-C has been proposed as a possible replacement for SU-8. In particular, this paper details the characterisation of residual stress in (i) SU-8 films as a function of processing temperatures and (ii) post-processing thermal treatment of Parylene-C. This characterisation includes wafer mapping strain using rotating pointer arm test structures, and deriving the stress from independent measurements of strain and Young’s modulus

M3 - Paper

SP - 98

EP - 103

T2 - 27th International Conference on Microelectronic Test Structures

Y2 - 24 March 2014 through 27 March 2014

ER -

Characterisation of Residual Stress in Dielectric Films Studied by Automated Wafer Mapping

Abstract

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