Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes

A. L. Bernassau, D. Hutson, C. E. M. Demore, S. Cochran

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

High frequency ultrasound transducer arrays that can operate at frequencies above 30 MHz are needed for high resolution medical imaging. A key issue in the development of these miniature imaging arrays is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires not only planar, parallel and smooth surfaces, but also an epoxy composite filler that is resistant to chemicals, heat and vacuum. This paper reports the full characterisation of an epoxy filler suitable for fine-scale piezocomposite fabrication as well as photolithographic processes.

Original languageEnglish
Title of host publication2008 IEEE Ultrasonics Symposium, Vols 1-4 and Appendix
Place of PublicationNew York
PublisherIEEE
Pages62-65
Number of pages4
ISBN (Print)978-1-4244-2428-3
DOIs
Publication statusPublished - 2008
EventIEEE Ultrasonics Symposium - Beijing, United Kingdom
Duration: 2 Nov 20085 Nov 2008

Publication series

NameULTRASONICS SYMPOSIUM
PublisherIEEE
ISSN (Print)1051-0117

Conference

ConferenceIEEE Ultrasonics Symposium
CountryUnited Kingdom
Period2/11/085/11/08

Keywords

  • Epoxy adhesive
  • cure temperature
  • material properties
  • acoustic properties
  • high frequency array
  • photolithography

Cite this

Bernassau, A. L., Hutson, D., Demore, C. E. M., & Cochran, S. (2008). Characterisation of an epoxy filler for piezocomposite material compatible with microfabrication processes. In 2008 IEEE Ultrasonics Symposium, Vols 1-4 and Appendix (pp. 62-65). (ULTRASONICS SYMPOSIUM). IEEE. https://doi.org/10.1109/ULTSYM.2008.0016