Birefringence analysis of aluminum-to-BK7 bonding methods under thermal stress

Nathan Macleod, Samuel Hann, Adrian Dzipalski, Ian F. Elder, Ian J. Thomson, Nicholas J. Weston, Richard Carter, Robert A. Lamb, Duncan Paul Hand, Michael Troughton, Matthew Jan Daniel Esser

Research output: Contribution to journalArticlepeer-review

73 Downloads (Pure)


Ultrafast laser welding, hydroxide catalysis bonding (HCB) and adhesive bonding techniques were used to bond N-BK7 cubes to aluminum bases. Using a thermal chamber and polariscope, the stress induced birefringence was measured at temperatures from -50°C to +80°C. Adhesive samples made with different industrial assembly methods were compared for thermal birefringent behavior. An ultrafast laser welded sample was thermally cycled in increasing temperature ranges, surviving the test with reduced retardation, indicating fatigue. An HCB sample was thermally cycled like the laser welded sample, and had a linear birefringent relation to temperature initially, and failed by fatigue after a fracture event.
Original languageEnglish
Pages (from-to)2621-2636
Number of pages16
JournalOptics Continuum
Issue number12
Publication statusPublished - 15 Dec 2022


Dive into the research topics of 'Birefringence analysis of aluminum-to-BK7 bonding methods under thermal stress'. Together they form a unique fingerprint.

Cite this