Bespoke interconnect technologies for optoelectronic and biomedical products

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Two technologies of topical importance in reducing the weight and volume of portable electronic products are (1) the creation of dense interconnects on an ever reducing silicon real-estate and (2) the formation of high aspect ratio through vias in silicon wafer and Printed Circuit Boards (PCBs) to allow interconnections across stacked devices. Whilst still important for biomedical and optoelectronic products, these interconnect technologies must take into account additional requirements which include material bio-compatibility as well as stringent deposition and assembly temperatures, making packaging and assembly highly challenging fields. This paper presents some interconnection technologies developed by the Microsystems Engineering Centre (MISEC) to address the aforementioned challenges in the area of optoelectronic biomedical devices. The use of these technologies for three prototype products, namely an integration optical encoder, a micro UV-LED array, a miniaturised ultrasonic transducer and an LED bonded onto a flexible substrate, are described and preliminary results are presented. A summary of the key findings and future work conclude this article. ©2010 IEEE.

Original languageEnglish
Title of host publication2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10
Pages1-4
Number of pages4
DOIs
Publication statusPublished - 2010
Event2010 International Symposium on Advanced Packaging Materials: Microtech - Cambridge, United Kingdom
Duration: 28 Feb 20102 Mar 2010

Conference

Conference2010 International Symposium on Advanced Packaging Materials: Microtech
Abbreviated titleAPM '10
CountryUnited Kingdom
CityCambridge
Period28/02/102/03/10

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Optoelectronic devices
Light emitting diodes
Ultrasonic transducers
Microsystems
Silicon wafers
Biocompatibility
Printed circuit boards
Aspect ratio
Packaging
Silicon
Substrates
Temperature

Cite this

Desmulliez, M. P. Y., & Flynn, D. (2010). Bespoke interconnect technologies for optoelectronic and biomedical products. In 2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10 (pp. 1-4) https://doi.org/10.1109/ISAPM.2010.5441388
Desmulliez, M. P Y ; Flynn, David. / Bespoke interconnect technologies for optoelectronic and biomedical products. 2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10. 2010. pp. 1-4
@inproceedings{79ef4a9f117441a2aa363a6e8912a0b1,
title = "Bespoke interconnect technologies for optoelectronic and biomedical products",
abstract = "Two technologies of topical importance in reducing the weight and volume of portable electronic products are (1) the creation of dense interconnects on an ever reducing silicon real-estate and (2) the formation of high aspect ratio through vias in silicon wafer and Printed Circuit Boards (PCBs) to allow interconnections across stacked devices. Whilst still important for biomedical and optoelectronic products, these interconnect technologies must take into account additional requirements which include material bio-compatibility as well as stringent deposition and assembly temperatures, making packaging and assembly highly challenging fields. This paper presents some interconnection technologies developed by the Microsystems Engineering Centre (MISEC) to address the aforementioned challenges in the area of optoelectronic biomedical devices. The use of these technologies for three prototype products, namely an integration optical encoder, a micro UV-LED array, a miniaturised ultrasonic transducer and an LED bonded onto a flexible substrate, are described and preliminary results are presented. A summary of the key findings and future work conclude this article. {\circledC}2010 IEEE.",
author = "Desmulliez, {M. P Y} and David Flynn",
year = "2010",
doi = "10.1109/ISAPM.2010.5441388",
language = "English",
isbn = "9781424467563",
pages = "1--4",
booktitle = "2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10",

}

Desmulliez, MPY & Flynn, D 2010, Bespoke interconnect technologies for optoelectronic and biomedical products. in 2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10. pp. 1-4, 2010 International Symposium on Advanced Packaging Materials: Microtech, Cambridge, United Kingdom, 28/02/10. https://doi.org/10.1109/ISAPM.2010.5441388

Bespoke interconnect technologies for optoelectronic and biomedical products. / Desmulliez, M. P Y; Flynn, David.

2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10. 2010. p. 1-4.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Bespoke interconnect technologies for optoelectronic and biomedical products

AU - Desmulliez, M. P Y

AU - Flynn, David

PY - 2010

Y1 - 2010

N2 - Two technologies of topical importance in reducing the weight and volume of portable electronic products are (1) the creation of dense interconnects on an ever reducing silicon real-estate and (2) the formation of high aspect ratio through vias in silicon wafer and Printed Circuit Boards (PCBs) to allow interconnections across stacked devices. Whilst still important for biomedical and optoelectronic products, these interconnect technologies must take into account additional requirements which include material bio-compatibility as well as stringent deposition and assembly temperatures, making packaging and assembly highly challenging fields. This paper presents some interconnection technologies developed by the Microsystems Engineering Centre (MISEC) to address the aforementioned challenges in the area of optoelectronic biomedical devices. The use of these technologies for three prototype products, namely an integration optical encoder, a micro UV-LED array, a miniaturised ultrasonic transducer and an LED bonded onto a flexible substrate, are described and preliminary results are presented. A summary of the key findings and future work conclude this article. ©2010 IEEE.

AB - Two technologies of topical importance in reducing the weight and volume of portable electronic products are (1) the creation of dense interconnects on an ever reducing silicon real-estate and (2) the formation of high aspect ratio through vias in silicon wafer and Printed Circuit Boards (PCBs) to allow interconnections across stacked devices. Whilst still important for biomedical and optoelectronic products, these interconnect technologies must take into account additional requirements which include material bio-compatibility as well as stringent deposition and assembly temperatures, making packaging and assembly highly challenging fields. This paper presents some interconnection technologies developed by the Microsystems Engineering Centre (MISEC) to address the aforementioned challenges in the area of optoelectronic biomedical devices. The use of these technologies for three prototype products, namely an integration optical encoder, a micro UV-LED array, a miniaturised ultrasonic transducer and an LED bonded onto a flexible substrate, are described and preliminary results are presented. A summary of the key findings and future work conclude this article. ©2010 IEEE.

UR - http://www.scopus.com/inward/record.url?scp=77952378636&partnerID=8YFLogxK

U2 - 10.1109/ISAPM.2010.5441388

DO - 10.1109/ISAPM.2010.5441388

M3 - Conference contribution

SN - 9781424467563

SP - 1

EP - 4

BT - 2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10

ER -

Desmulliez MPY, Flynn D. Bespoke interconnect technologies for optoelectronic and biomedical products. In 2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10. 2010. p. 1-4 https://doi.org/10.1109/ISAPM.2010.5441388