Agile MEMS packaging for mass customized MEMS products

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publication2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Aix-en-Provence, France
PublisherIEEE
ISBN (Print)978-1-61284-905-8
Publication statusPublished - 11 May 2011
EventDTIP Design, Test, Integration & Packaging of MEMS/MOEMS - , United Kingdom
Duration: 11 May 2011 → …

Conference

ConferenceDTIP Design, Test, Integration & Packaging of MEMS/MOEMS
CountryUnited Kingdom
Period11/05/11 → …

Cite this

Kaufmann, J., Flynn, D., Brown, K. E., & Desmulliez, M. P. Y. (2011). Agile MEMS packaging for mass customized MEMS products. In 2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Aix-en-Provence, France IEEE.
Kaufmann, Jens ; Flynn, David ; Brown, Keith Edgar ; Desmulliez, Marc Phillipe Yves. / Agile MEMS packaging for mass customized MEMS products. 2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Aix-en-Provence, France. IEEE, 2011.
@inproceedings{fddd1dd0b62547d097cf3cb223e0849c,
title = "Agile MEMS packaging for mass customized MEMS products",
author = "Jens Kaufmann and David Flynn and Brown, {Keith Edgar} and Desmulliez, {Marc Phillipe Yves}",
year = "2011",
month = "5",
day = "11",
language = "English",
isbn = "978-1-61284-905-8",
booktitle = "2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Aix-en-Provence, France",
publisher = "IEEE",
address = "United States",

}

Kaufmann, J, Flynn, D, Brown, KE & Desmulliez, MPY 2011, Agile MEMS packaging for mass customized MEMS products. in 2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Aix-en-Provence, France. IEEE, DTIP Design, Test, Integration & Packaging of MEMS/MOEMS, United Kingdom, 11/05/11.

Agile MEMS packaging for mass customized MEMS products. / Kaufmann, Jens; Flynn, David; Brown, Keith Edgar; Desmulliez, Marc Phillipe Yves.

2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Aix-en-Provence, France. IEEE, 2011.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Agile MEMS packaging for mass customized MEMS products

AU - Kaufmann, Jens

AU - Flynn, David

AU - Brown, Keith Edgar

AU - Desmulliez, Marc Phillipe Yves

PY - 2011/5/11

Y1 - 2011/5/11

M3 - Conference contribution

SN - 978-1-61284-905-8

BT - 2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Aix-en-Provence, France

PB - IEEE

ER -

Kaufmann J, Flynn D, Brown KE, Desmulliez MPY. Agile MEMS packaging for mass customized MEMS products. In 2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Aix-en-Provence, France. IEEE. 2011