Agile MEMS packaging for mass customized MEMS products

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The market for micro electromechanical systems (MEMS) is becoming increasingly competitive especially for small and medium sized enterprises. The progressing trend in mass manufacturing leads to very few competitors that dominate the MEMS market. This competitive environment results in cheap devices with limited variation, therefore opportunities at the tail end of the market are usually neglected. The MEMS research community predominantly focuses on new device types and manufacturing methods with a high impact factor and those are naturally settled in the mass market segments. This paper introduces an approach for research and development that aims to open the opportunities within the long tail of the market. It consists mostly of a combination of new design approaches for MEMS and packaging, software tools and digital manufacturing technologies to ensure that solutions developed are ones that can be adapted to different customer requirement on a level that is perhaps uncommon in the MEMS community.
Original languageEnglish
Title of host publication2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
PublisherIEEE
Pages41-45
Number of pages5
ISBN (Print)9781612849058
Publication statusPublished - 23 Jan 2012
Event2011 Symposium on DTIP Design, Test, Integration & Packaging of MEMS/MOEMS - Aix-en-Provence, France
Duration: 11 May 201113 May 2011

Conference

Conference2011 Symposium on DTIP Design, Test, Integration & Packaging of MEMS/MOEMS
CountryFrance
CityAix-en-Provence
Period11/05/1113/05/11

Keywords

  • MEMs
  • MEMS packaging
  • MEMS integration
  • aviation

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  • Cite this

    Kaufmann, J., Flynn, D., Brown, K. E., & Desmulliez, M. P. Y. (2012). Agile MEMS packaging for mass customized MEMS products. In 2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) (pp. 41-45). IEEE.