Advances in the design and test of a novel open ended microwave oven

Sumanth K. Pavuluri, Tim Tilford, George Goussetis, M. P Y Desmulliez, Marju Ferenets, Raphael Adamietz, Frank Eicher, Chris Bailey

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An enhanced open ended waveguide cavity oven is presented with improved uniform heating, heating rates and power conversion efficiency. This next generation oven produces more uniform EM fields in the evanescent region forming part of the heating area of the oven. These fields are vital for the rapid and uniform heating of various electromagnetically lossy materials. A fibre optic temperature sensor is used to measure in situ and in real-time the temperature of the curing materials. An automatic computer controlled closed feedback loop measures the temperature in the curing material and drives the microwave components to obtain predetermined curing temperature cycles for efficient curing. Uniform curing of the lossy encapsulants is achieved with this oven with typical cure cycle of 270 seconds with a ramp rate of 1 °C/s and a hold period of 2 minutes. Differential scanning calorimeter based measurement for the pulsed microwave based curing of the polymer dielectric indicates an 98% degree of cure. © 2010 EDA Publishing/DTIP.

Original languageEnglish
Title of host publicationSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
Pages247-252
Number of pages6
Publication statusPublished - 2010
EventSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010 - Seville, Spain
Duration: 5 May 20107 May 2010

Conference

ConferenceSymposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010
CountrySpain
CitySeville
Period5/05/107/05/10

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  • Cite this

    Pavuluri, S. K., Tilford, T., Goussetis, G., Desmulliez, M. P. Y., Ferenets, M., Adamietz, R., Eicher, F., & Bailey, C. (2010). Advances in the design and test of a novel open ended microwave oven. In Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010 (pp. 247-252)