Advances in laser based joining processes of micro-devices using localised heating

Norbert Lorenz, Martin D. Smith, Suzanne Millar, Marc Desmulliez, Duncan P. Hand

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

One of the remaining issues in the fabrication of micro-devices, including MEMS, is the packaging process. Standard techniques involve heating the whole device to high temperatures, preventing the use of temperature-sensitive materials within the package (e.g. polymer and magnetic materials) and generating problems in manufacturing processes where a number of thermal process steps are carried out in sequence, when a later heating step can cause parts joined earlier to disassemble. In our previous studies we demonstrated that it is feasible to combine the benefits of intermediate layer bonding and laser heating to achieve packaging processes where the required high temperatures are highly localised. Previously only single chip packaging was presented and therefore in this paper we demonstrate solutions to the issues involved in laser-based wafer-level packaging, where many devices are packaged on a single silicon wafer. In this case our example is a silicon-glass package using a Benzocyclobutene intermediate layer - materials commonly used in MEMS fabrication. We also report on developments for packages requiring a moderate vacuum with long-term stability. Here a glass-frit based process using localised laser heating is described.

Original languageEnglish
Title of host publicationICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings
Pages999-1007
Number of pages9
Volume102
Publication statusPublished - 2009
Event28th International Congress on Applications of Lasers and Electro-Optics - Orlando, FL, United States
Duration: 2 Nov 20095 Nov 2009

Conference

Conference28th International Congress on Applications of Lasers and Electro-Optics
Abbreviated titleICALEO 2009
CountryUnited States
CityOrlando, FL
Period2/11/095/11/09

Keywords

  • Laser joining
  • Localised heating
  • Vacuum packaging
  • Wafer-level

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  • Cite this

    Lorenz, N., Smith, M. D., Millar, S., Desmulliez, M., & Hand, D. P. (2009). Advances in laser based joining processes of micro-devices using localised heating. In ICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings (Vol. 102, pp. 999-1007)