Advanced microwave oven for rapid curing of encapsulant

K. I. Sinclair, T. Tilford, G. Goussetis, C. Bailey, M. P Y Desmulliez, A. K. Parrott, A. J. Sangster

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The curing of a thermosetting polymer materials utilized on micro-electronics packaging applications can be performed using microwave systems. The use of microwave energy enables the cure process to be completed more rapidly than with alternative approaches due to the ability to heat volumetrically. Furthermore, advanced dual-section microwave systems enable curing of individual components on a chip-on-board assembly. The dielectric properties of thermosetting polymer materials, commonly used in microelectronics packaging applications, vary significantly with temperature and degree of cure. The heating rate within a material subjected to an electric field is primarily dependant on the dielectric loss properties of the material itself. This article examines the variation in dielectric properties of a commercially available encapsulant paste with frequency and temperature and the resulting influence on the cure process. The 'FAMOBS' dual section microwave system and its application to microelectronics manufacture are described. The measurement of the dielectric properties of 'Henkel EO1080' encapsulant paste uses a commercially available 'dielectric probe kit' and is described in this paper. The FAMOBS heating system is used to encapsulate a small op-amp chip. A numerical model formulated to assess the cure process in thermosetting polymer materials under microwave heating is outlined. Numerical results showing that the microwave processing systems is capable of rapidly and evenly curing thermosetting polymer materials are presented. ©2008 IEEE.

Original languageEnglish
Title of host publicationProceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Pages551-556
Number of pages6
DOIs
Publication statusPublished - 2008
Event2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom
Duration: 1 Sep 20084 Sep 2008

Conference

Conference2008 2nd Electronics Systemintegration Technology Conference
Abbreviated titleESTC
CountryUnited Kingdom
CityGreenwich
Period1/09/084/09/08

Fingerprint

Microwave ovens
Curing
Microwaves
Microelectronics
Dielectric properties
Polymers
Electronics packaging
Microwave heating
Operational amplifiers
Dielectric losses
Heating rate
Numerical models
Packaging
Electric fields
Heating
Temperature
Processing

Cite this

Sinclair, K. I., Tilford, T., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K., & Sangster, A. J. (2008). Advanced microwave oven for rapid curing of encapsulant. In Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC (pp. 551-556) https://doi.org/10.1109/ESTC.2008.4684409
Sinclair, K. I. ; Tilford, T. ; Goussetis, G. ; Bailey, C. ; Desmulliez, M. P Y ; Parrott, A. K. ; Sangster, A. J. / Advanced microwave oven for rapid curing of encapsulant. Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. 2008. pp. 551-556
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title = "Advanced microwave oven for rapid curing of encapsulant",
abstract = "The curing of a thermosetting polymer materials utilized on micro-electronics packaging applications can be performed using microwave systems. The use of microwave energy enables the cure process to be completed more rapidly than with alternative approaches due to the ability to heat volumetrically. Furthermore, advanced dual-section microwave systems enable curing of individual components on a chip-on-board assembly. The dielectric properties of thermosetting polymer materials, commonly used in microelectronics packaging applications, vary significantly with temperature and degree of cure. The heating rate within a material subjected to an electric field is primarily dependant on the dielectric loss properties of the material itself. This article examines the variation in dielectric properties of a commercially available encapsulant paste with frequency and temperature and the resulting influence on the cure process. The 'FAMOBS' dual section microwave system and its application to microelectronics manufacture are described. The measurement of the dielectric properties of 'Henkel EO1080' encapsulant paste uses a commercially available 'dielectric probe kit' and is described in this paper. The FAMOBS heating system is used to encapsulate a small op-amp chip. A numerical model formulated to assess the cure process in thermosetting polymer materials under microwave heating is outlined. Numerical results showing that the microwave processing systems is capable of rapidly and evenly curing thermosetting polymer materials are presented. {\circledC}2008 IEEE.",
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Sinclair, KI, Tilford, T, Goussetis, G, Bailey, C, Desmulliez, MPY, Parrott, AK & Sangster, AJ 2008, Advanced microwave oven for rapid curing of encapsulant. in Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. pp. 551-556, 2008 2nd Electronics Systemintegration Technology Conference, Greenwich, United Kingdom, 1/09/08. https://doi.org/10.1109/ESTC.2008.4684409

Advanced microwave oven for rapid curing of encapsulant. / Sinclair, K. I.; Tilford, T.; Goussetis, G.; Bailey, C.; Desmulliez, M. P Y; Parrott, A. K.; Sangster, A. J.

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. 2008. p. 551-556.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AB - The curing of a thermosetting polymer materials utilized on micro-electronics packaging applications can be performed using microwave systems. The use of microwave energy enables the cure process to be completed more rapidly than with alternative approaches due to the ability to heat volumetrically. Furthermore, advanced dual-section microwave systems enable curing of individual components on a chip-on-board assembly. The dielectric properties of thermosetting polymer materials, commonly used in microelectronics packaging applications, vary significantly with temperature and degree of cure. The heating rate within a material subjected to an electric field is primarily dependant on the dielectric loss properties of the material itself. This article examines the variation in dielectric properties of a commercially available encapsulant paste with frequency and temperature and the resulting influence on the cure process. The 'FAMOBS' dual section microwave system and its application to microelectronics manufacture are described. The measurement of the dielectric properties of 'Henkel EO1080' encapsulant paste uses a commercially available 'dielectric probe kit' and is described in this paper. The FAMOBS heating system is used to encapsulate a small op-amp chip. A numerical model formulated to assess the cure process in thermosetting polymer materials under microwave heating is outlined. Numerical results showing that the microwave processing systems is capable of rapidly and evenly curing thermosetting polymer materials are presented. ©2008 IEEE.

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Sinclair KI, Tilford T, Goussetis G, Bailey C, Desmulliez MPY, Parrott AK et al. Advanced microwave oven for rapid curing of encapsulant. In Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. 2008. p. 551-556 https://doi.org/10.1109/ESTC.2008.4684409