Advanced electrical array interconnections for ultrasound probes integrated in surgical needles

Giuseppe Schiavone, Thomas Jones, Dennis Price, Rachael McPhillips, Zhen Qiu, Christine E M Demore, Yun Jiang, Carl Meggs, Syed O. Mahboob, Sam Eljamel, Tim W. Button, Sandy Cochran, Marc P Y Desmulliez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Real-time ultrasound guidance during neurosurgery is a novel and sought-after technique that enables imaging data to be acquired with improved precision during surgical intervention. Surgical needles that are inserted in the tissue of interest can be guided using the real-time graphical information collected by an embedded ultrasound transducer. The miniaturisation capabilities of modern manufacturing technologies allow the fabrication of ultrasound probes that are small enough to be fitted in needles conventionally used in surgical practices (down to ∼2 mm inner diameter). High lateral resolution may in fact be achieved by producing miniaturised ultrasound transducer arrays with a series of emitting/receiving elements, each electrically isolated from the others. To guarantee the functionality of such devices, a series of independent electrical interconnections must be implemented that enables the external driving electronics of the imaging system to be connected to the miniaturised ultrasound probe array. This paper presents a novel interconnection scheme designed to interface ultrasound probes integrated in surgical needles with the driving electronics. The presented solution utilises a flexible printed circuit board carrying the electrical tracks and a bonding technique with an anisotropic conductive paste.

Original languageEnglish
Title of host publicationProceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
PublisherIEEE
Pages88-93
Number of pages6
ISBN (Print)9781479969944
DOIs
Publication statusPublished - 2014
Event2014 16th IEEE Electronics Packaging Technology Conference - Singapore, United Kingdom
Duration: 3 Dec 20145 Dec 2014

Conference

Conference2014 16th IEEE Electronics Packaging Technology Conference
Abbreviated titleEPTC 2014
Country/TerritoryUnited Kingdom
CitySingapore
Period3/12/145/12/14

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