Adaptive packaging solution for a microlens array placed over a micro-UV-LED array

Markus Luetzelschwab, Dominik Weiland, M. P Y Desmulliez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this article a versatile packaging solution is presented that allows the static and active alignment of a microlens array that is to be placed over a microUV-LED array. A modified UV-LIGA process is applied for building up the structure. For the static approach, the microlens array rests on four posts with the aim of reducing the contact area between the two parts, hence reducing the probability of vertical misalignment. The fine height adjustment is done by electroplating a certain thickness to the electrodes where the posts are being placed. Since the electrodes can be individually addressed, a possible tilt, caused by uneven post heights, can be compensated. With minimal modifications, the structure can be rendered into a dynamic alignment system, featuring actuators for vertical and lateral movement. Even though the microlens array is part of the actuator itself, it is not connected to any potential or energy sources. A magnetic actuator is proposed and partly tested that is capable of simultaneously perform a lateral movement while the vertical actuation is in progress. As a restoring means, a gel material is used as a precursor for a photo-patternable PDMS structure. © 2008 International Federation for Information Processing.

Original languageEnglish
Title of host publicationMicro-Assembly Technologies and Applications: IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France February 10-13, 2008
Pages129-138
Number of pages10
Volume260
DOIs
Publication statusPublished - 2008

Publication series

NameIFIP International Federation for Information Processing
Volume260
ISSN (Print)1571-5736

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Light emitting diodes
Packaging
Actuators
Magnetic actuators
Electrodes
Electroplating
Gels

Cite this

Luetzelschwab, M., Weiland, D., & Desmulliez, M. P. Y. (2008). Adaptive packaging solution for a microlens array placed over a micro-UV-LED array. In Micro-Assembly Technologies and Applications: IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France February 10-13, 2008 (Vol. 260, pp. 129-138). (IFIP International Federation for Information Processing; Vol. 260). https://doi.org/10.1007/978-0-387-77405-3_12
Luetzelschwab, Markus ; Weiland, Dominik ; Desmulliez, M. P Y. / Adaptive packaging solution for a microlens array placed over a micro-UV-LED array. Micro-Assembly Technologies and Applications: IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France February 10-13, 2008. Vol. 260 2008. pp. 129-138 (IFIP International Federation for Information Processing).
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abstract = "In this article a versatile packaging solution is presented that allows the static and active alignment of a microlens array that is to be placed over a microUV-LED array. A modified UV-LIGA process is applied for building up the structure. For the static approach, the microlens array rests on four posts with the aim of reducing the contact area between the two parts, hence reducing the probability of vertical misalignment. The fine height adjustment is done by electroplating a certain thickness to the electrodes where the posts are being placed. Since the electrodes can be individually addressed, a possible tilt, caused by uneven post heights, can be compensated. With minimal modifications, the structure can be rendered into a dynamic alignment system, featuring actuators for vertical and lateral movement. Even though the microlens array is part of the actuator itself, it is not connected to any potential or energy sources. A magnetic actuator is proposed and partly tested that is capable of simultaneously perform a lateral movement while the vertical actuation is in progress. As a restoring means, a gel material is used as a precursor for a photo-patternable PDMS structure. {\circledC} 2008 International Federation for Information Processing.",
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Luetzelschwab, M, Weiland, D & Desmulliez, MPY 2008, Adaptive packaging solution for a microlens array placed over a micro-UV-LED array. in Micro-Assembly Technologies and Applications: IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France February 10-13, 2008. vol. 260, IFIP International Federation for Information Processing, vol. 260, pp. 129-138. https://doi.org/10.1007/978-0-387-77405-3_12

Adaptive packaging solution for a microlens array placed over a micro-UV-LED array. / Luetzelschwab, Markus; Weiland, Dominik; Desmulliez, M. P Y.

Micro-Assembly Technologies and Applications: IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France February 10-13, 2008. Vol. 260 2008. p. 129-138 (IFIP International Federation for Information Processing; Vol. 260).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Luetzelschwab M, Weiland D, Desmulliez MPY. Adaptive packaging solution for a microlens array placed over a micro-UV-LED array. In Micro-Assembly Technologies and Applications: IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France February 10-13, 2008. Vol. 260. 2008. p. 129-138. (IFIP International Federation for Information Processing). https://doi.org/10.1007/978-0-387-77405-3_12