A thermal isolation technique using through-silicon vias for three-dimensional ICs

  • Sanming Hu*
  • , Yen Yi Germaine Hoe
  • , Hongyu Li
  • , Dan Zhao
  • , Jinglin Shi
  • , Yong Han
  • , Keng Hwa Teo
  • , Yong Zhong Xiong
  • , Jin He
  • , Xiaowu Zhang
  • , Minkyu Je
  • , Mohammad Madihian
    • *Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

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