A review of stencil printing for microelectronic packaging

Robert Kay, Marc Desmulliez

Research output: Contribution to journalLiterature review

23 Citations (Scopus)
1862 Downloads (Pure)

Abstract

Purpose - The purpose of this paper is to present a detailed overview of the current stencil printing process for microelectronic packaging.

Design/methodology/approach - This paper gives a thorough review of stencil printing for electronic packaging including the current state of the art.

Findings - This article explains the different stencil technologies and printing materials. It then examines the various factors that determine the outcome of a successful printing process, including printing parameters, materials, apparatus and squeegees. Relevant technical innovations in the art of stencil printing for microelectronics packaging are examined as each part of the printing process is explained.

Originality/value - Stencil printing is currently the cheapest and highest throughput technique to create the mechanical and electrically conductive connections between substrates, bare die, packaged chips and discrete components. As a result, this process is used extensively in the electronic packaging industry and therefore such a review paper should be of interest to a large selection of the electronics interconnect and assembly community.

Original languageEnglish
Pages (from-to)38-50
Number of pages13
JournalSoldering and Surface Mount Technology
Volume24
Issue number1
DOIs
Publication statusPublished - 2012

Keywords

  • Innovation
  • Microelectronics packaging
  • Packaging processes
  • Stencil printing

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