Abstract
Purpose - Recently nanoparticles reinforced lead free solders are vastly developed in electronics packaging industry. Studies and investigations have been conducted to learn and investigate the types, properties, method, availability and importance of nanoparticles in this field. Design/methodology/ approach - Mechanical properties, melting temperature and microstructural conditions are taken into major considerations in any of the preparation on nanoparticles and being reviewed in this paper. Segregation of the types of nanoparticles being added together with their properties is summarized in this paper. High temperature reliability is crucial in providing a good viable solder and hence addition of nanoparticles have been seen to give a positive outcome in this particular property. Findings - This paper reviews on the beneficial of the various nanoparticles addition in the solder. Briefed explanations and the factors are revealed in this review. Originality/value - This paper reviews on the beneficial of the various nanoparticles addition in the solder.
| Original language | English |
|---|---|
| Pages (from-to) | 229-241 |
| Number of pages | 13 |
| Journal | Soldering and Surface Mount Technology |
| Volume | 25 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 9 Sept 2013 |
Keywords
- Alloys
- Intermetallic compounds
- Microstructure
- Pb-free
- Shear strength
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Electrical and Electronic Engineering