A Rapid and Selective Laser Sintering Method of Silver Nanoparticles for High Temperature Electronic Devices Packaging

Guandong Liu; Changhai Wang; Binod Bhandari; Jonathan Swingler

doi:10.1109/icept59018.2023.10492343

A Rapid and Selective Laser Sintering Method of Silver Nanoparticles for High Temperature Electronic Devices Packaging

Guandong Liu, Changhai Wang, Binod Bhandari, Jonathan Swingler

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper presents a laser-assisted sintering method of a silver nanoparticle paste for high temperature die-attach applications. Compared with the sintering time of tens of minutes based on the conventional hotplate-based method, an average shear strength of 9.7 MPa was obtained with a very short laser irradiation time of 1 minute, and the maximum shear strength was improved to 30.2 MPa by increasing the laser irradiation time to 5 minutes. In addition, from the morphology of the sample after a short-time laser sintering process, it can be observed that only the local area around the chip was oxidized. These results demonstrate that the laser-based sintering method is not only a significant way to improve the manufacturing efficiency, but also a localized and selective packaging method. Therefore, the laser-assisted sintering method can be used in the packaging of high temperature electronic devices or heterogeneous integration of chips with different shapes and operating temperatures.

Original language	English
Title of host publication	24th International Conference on Electronic Packaging Technology (ICEPT)
Publisher	IEEE
ISBN (Electronic)	9798350338812
DOIs	https://doi.org/10.1109/icept59018.2023.10492343
Publication status	Published - 11 Apr 2024
Event	24th International Conference on Electronic Packaging Technology 2023 - Shihezi City, China Duration: 8 Aug 2023 → 11 Aug 2023

Conference

Conference	24th International Conference on Electronic Packaging Technology 2023
Abbreviated title	ICEPT 2023
Country/Territory	China
City	Shihezi City
Period	8/08/23 → 11/08/23

Keywords

high temperature
laser-assisted sintering
silver nanoparticle paste

ASJC Scopus subject areas

Mechanics of Materials
Electronic, Optical and Magnetic Materials
Safety, Risk, Reliability and Quality
Fluid Flow and Transfer Processes
Electrical and Electronic Engineering
Hardware and Architecture

Access to Document

10.1109/icept59018.2023.10492343

Cite this

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title = "A Rapid and Selective Laser Sintering Method of Silver Nanoparticles for High Temperature Electronic Devices Packaging",

abstract = "This paper presents a laser-assisted sintering method of a silver nanoparticle paste for high temperature die-attach applications. Compared with the sintering time of tens of minutes based on the conventional hotplate-based method, an average shear strength of 9.7 MPa was obtained with a very short laser irradiation time of 1 minute, and the maximum shear strength was improved to 30.2 MPa by increasing the laser irradiation time to 5 minutes. In addition, from the morphology of the sample after a short-time laser sintering process, it can be observed that only the local area around the chip was oxidized. These results demonstrate that the laser-based sintering method is not only a significant way to improve the manufacturing efficiency, but also a localized and selective packaging method. Therefore, the laser-assisted sintering method can be used in the packaging of high temperature electronic devices or heterogeneous integration of chips with different shapes and operating temperatures.",

keywords = "high temperature, laser-assisted sintering, silver nanoparticle paste",

author = "Guandong Liu and Changhai Wang and Binod Bhandari and Jonathan Swingler",

year = "2024",

month = apr,

day = "11",

doi = "10.1109/icept59018.2023.10492343",

language = "English",

booktitle = "24th International Conference on Electronic Packaging Technology (ICEPT)",

publisher = "IEEE",

address = "United States",

note = "24th International Conference on Electronic Packaging Technology 2023 , ICEPT 2023 ; Conference date: 08-08-2023 Through 11-08-2023",

}

Liu, G, Wang, C, Bhandari, B & Swingler, J 2024, A Rapid and Selective Laser Sintering Method of Silver Nanoparticles for High Temperature Electronic Devices Packaging. in 24th International Conference on Electronic Packaging Technology (ICEPT)., 10492343, IEEE, 24th International Conference on Electronic Packaging Technology 2023 , Shihezi City, China, 8/08/23. https://doi.org/10.1109/icept59018.2023.10492343

TY - GEN

T1 - A Rapid and Selective Laser Sintering Method of Silver Nanoparticles for High Temperature Electronic Devices Packaging

AU - Liu, Guandong

AU - Wang, Changhai

AU - Bhandari, Binod

AU - Swingler, Jonathan

PY - 2024/4/11

Y1 - 2024/4/11

N2 - This paper presents a laser-assisted sintering method of a silver nanoparticle paste for high temperature die-attach applications. Compared with the sintering time of tens of minutes based on the conventional hotplate-based method, an average shear strength of 9.7 MPa was obtained with a very short laser irradiation time of 1 minute, and the maximum shear strength was improved to 30.2 MPa by increasing the laser irradiation time to 5 minutes. In addition, from the morphology of the sample after a short-time laser sintering process, it can be observed that only the local area around the chip was oxidized. These results demonstrate that the laser-based sintering method is not only a significant way to improve the manufacturing efficiency, but also a localized and selective packaging method. Therefore, the laser-assisted sintering method can be used in the packaging of high temperature electronic devices or heterogeneous integration of chips with different shapes and operating temperatures.

AB - This paper presents a laser-assisted sintering method of a silver nanoparticle paste for high temperature die-attach applications. Compared with the sintering time of tens of minutes based on the conventional hotplate-based method, an average shear strength of 9.7 MPa was obtained with a very short laser irradiation time of 1 minute, and the maximum shear strength was improved to 30.2 MPa by increasing the laser irradiation time to 5 minutes. In addition, from the morphology of the sample after a short-time laser sintering process, it can be observed that only the local area around the chip was oxidized. These results demonstrate that the laser-based sintering method is not only a significant way to improve the manufacturing efficiency, but also a localized and selective packaging method. Therefore, the laser-assisted sintering method can be used in the packaging of high temperature electronic devices or heterogeneous integration of chips with different shapes and operating temperatures.

KW - high temperature

KW - laser-assisted sintering

KW - silver nanoparticle paste

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U2 - 10.1109/icept59018.2023.10492343

DO - 10.1109/icept59018.2023.10492343

M3 - Conference contribution

BT - 24th International Conference on Electronic Packaging Technology (ICEPT)

PB - IEEE

T2 - 24th International Conference on Electronic Packaging Technology 2023

Y2 - 8 August 2023 through 11 August 2023

ER -

A Rapid and Selective Laser Sintering Method of Silver Nanoparticles for High Temperature Electronic Devices Packaging

Abstract

Conference

Keywords

ASJC Scopus subject areas

Access to Document

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