A novel X-ray diffraction technique for analysis of die stress inside fully encapsulated packaged chips

Chiu Soon Wong, Nick Bennett, David Allen, Andreas Danilewsky, Patrick McNally

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Manufacturing-induced thermal stress created during the fabrication of packaged integrated circuits can potentially lead to device failure. Therefore, the need to develop metrologies that can be used to effectively measure stress/strain in systems-on-chip or systems-in-package is identified by the International Technology Roadmap for Semiconductors (ITRS). In this study, a novel technique for non-destructive analysis of strain/warpage inside completely encapsulated packaged chips, at room temperature and processed at elevated temperatures up to 115°C, is developed using a laboratory-based X-ray diffraction tool. Maps are produced of the entire silicon die, which reveal warpage via mapping of rocking curve full-widths-at-half-maximum (FWHM) as a function of position across encapsulated packages, using a technique known as 3-dimensional surface modelling. We develop complete Si die maps of the large thermal stresses that are developed during the die attach process due to the coefficient of thermal expansion mismatch between different materials. These are confirmed by in situ X-ray diffraction annealing experiments, as well as finite element analysis (FEA).

Original languageEnglish
Title of host publication2012 4th Electronic System-Integration Technology Conference (ESTC), 2012
PublisherIEEE
ISBN (Print)9781467346450
DOIs
Publication statusPublished - 2012
Event4th Electronic System-Integration Technology Conference 2012 - Amsterdam, Netherlands
Duration: 17 Sep 201220 Sep 2012

Conference

Conference4th Electronic System-Integration Technology Conference 2012
Abbreviated titleESTC 2012
CountryNetherlands
CityAmsterdam
Period17/09/1220/09/12

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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    Wong, C. S., Bennett, N., Allen, D., Danilewsky, A., & McNally, P. (2012). A novel X-ray diffraction technique for analysis of die stress inside fully encapsulated packaged chips. In 2012 4th Electronic System-Integration Technology Conference (ESTC), 2012 [6542095] IEEE. https://doi.org/10.1109/ESTC.2012.6542095