A novel open waveguide cavity resonator for the combined variable frequency microwave (VFM) curing of bumps, underfills and encapsulants, as well as the alignment of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP) is presented. This invention achieves radio frequency (RF) curing of adhesives used in microelectronics, optoelectronics and medical devices with potential simultaneous micron-scale alignment accuracy and bonding of devices using VFM technology. The open oven cavity can befitted directly onto a flip-chip or wafer scale bonder and, as such, will allow for the bonding of devices through localised heating thus reducing the risk to thermally sensitive devices. © 2006 IEEE.
|Title of host publication||ESTC 2006 - 1st Electronics Systemintegration Technology Conference|
|Number of pages||9|
|Publication status||Published - 2007|
|Event||ESTC 2006 - 1st Electronics Systemintegration Technology Conference - Dresden, Saxony, Germany|
Duration: 5 Sept 2006 → 7 Sept 2006
|Conference||ESTC 2006 - 1st Electronics Systemintegration Technology Conference|
|Period||5/09/06 → 7/09/06|