A novel RF-curing technology for microelectronics and optoelectronics packaging

K. I. Sinclair, M. P Y Desmulliez, A. J. Sangster

Research output: Chapter in Book/Report/Conference proceedingConference contribution

24 Citations (Scopus)

Abstract

A novel open waveguide cavity resonator for the combined variable frequency microwave (VFM) curing of bumps, underfills and encapsulants, as well as the alignment of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP) is presented. This invention achieves radio frequency (RF) curing of adhesives used in microelectronics, optoelectronics and medical devices with potential simultaneous micron-scale alignment accuracy and bonding of devices using VFM technology. The open oven cavity can befitted directly onto a flip-chip or wafer scale bonder and, as such, will allow for the bonding of devices through localised heating thus reducing the risk to thermally sensitive devices. © 2006 IEEE.

Original languageEnglish
Title of host publicationESTC 2006 - 1st Electronics Systemintegration Technology Conference
Pages1149-1157
Number of pages9
Volume2
DOIs
Publication statusPublished - 2007
EventESTC 2006 - 1st Electronics Systemintegration Technology Conference - Dresden, Saxony, Germany
Duration: 5 Sep 20067 Sep 2006

Conference

ConferenceESTC 2006 - 1st Electronics Systemintegration Technology Conference
CountryGermany
CityDresden, Saxony
Period5/09/067/09/06

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  • Cite this

    Sinclair, K. I., Desmulliez, M. P. Y., & Sangster, A. J. (2007). A novel RF-curing technology for microelectronics and optoelectronics packaging. In ESTC 2006 - 1st Electronics Systemintegration Technology Conference (Vol. 2, pp. 1149-1157) https://doi.org/10.1109/ESTC.2006.280155