A novel RF-curing technology for microelectronics and optoelectronics packaging

K. I. Sinclair; M. P Y Desmulliez; A. J. Sangster

doi:10.1109/ESTC.2006.280155

A novel RF-curing technology for microelectronics and optoelectronics packaging

K. I. Sinclair, M. P Y Desmulliez, A. J. Sangster

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

25 Citations (Scopus)

Abstract

A novel open waveguide cavity resonator for the combined variable frequency microwave (VFM) curing of bumps, underfills and encapsulants, as well as the alignment of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP) is presented. This invention achieves radio frequency (RF) curing of adhesives used in microelectronics, optoelectronics and medical devices with potential simultaneous micron-scale alignment accuracy and bonding of devices using VFM technology. The open oven cavity can befitted directly onto a flip-chip or wafer scale bonder and, as such, will allow for the bonding of devices through localised heating thus reducing the risk to thermally sensitive devices. © 2006 IEEE.

Original language	English
Title of host publication	ESTC 2006 - 1st Electronics Systemintegration Technology Conference
Pages	1149-1157
Number of pages	9
Volume	2
DOIs	https://doi.org/10.1109/ESTC.2006.280155
Publication status	Published - 2007
Event	ESTC 2006 - 1st Electronics Systemintegration Technology Conference - Dresden, Saxony, Germany Duration: 5 Sept 2006 → 7 Sept 2006

Conference

Conference	ESTC 2006 - 1st Electronics Systemintegration Technology Conference
Country/Territory	Germany
City	Dresden, Saxony
Period	5/09/06 → 7/09/06

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10.1109/ESTC.2006.280155

Cite this

@inproceedings{bfa42b2239904fffa4565da1bd059fb5,

title = "A novel RF-curing technology for microelectronics and optoelectronics packaging",

abstract = "A novel open waveguide cavity resonator for the combined variable frequency microwave (VFM) curing of bumps, underfills and encapsulants, as well as the alignment of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP) is presented. This invention achieves radio frequency (RF) curing of adhesives used in microelectronics, optoelectronics and medical devices with potential simultaneous micron-scale alignment accuracy and bonding of devices using VFM technology. The open oven cavity can befitted directly onto a flip-chip or wafer scale bonder and, as such, will allow for the bonding of devices through localised heating thus reducing the risk to thermally sensitive devices. {\textcopyright} 2006 IEEE.",

author = "Sinclair, {K. I.} and Desmulliez, {M. P Y} and Sangster, {A. J.}",

year = "2007",

doi = "10.1109/ESTC.2006.280155",

language = "English",

isbn = "1424405521",

volume = "2",

pages = "1149--1157",

booktitle = "ESTC 2006 - 1st Electronics Systemintegration Technology Conference",

note = "ESTC 2006 - 1st Electronics Systemintegration Technology Conference ; Conference date: 05-09-2006 Through 07-09-2006",

}

Sinclair, KI, Desmulliez, MPY & Sangster, AJ 2007, A novel RF-curing technology for microelectronics and optoelectronics packaging. in ESTC 2006 - 1st Electronics Systemintegration Technology Conference. vol. 2, pp. 1149-1157, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, Dresden, Saxony, Germany, 5/09/06. https://doi.org/10.1109/ESTC.2006.280155

TY - GEN

T1 - A novel RF-curing technology for microelectronics and optoelectronics packaging

AU - Sinclair, K. I.

AU - Desmulliez, M. P Y

AU - Sangster, A. J.

PY - 2007

Y1 - 2007

N2 - A novel open waveguide cavity resonator for the combined variable frequency microwave (VFM) curing of bumps, underfills and encapsulants, as well as the alignment of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP) is presented. This invention achieves radio frequency (RF) curing of adhesives used in microelectronics, optoelectronics and medical devices with potential simultaneous micron-scale alignment accuracy and bonding of devices using VFM technology. The open oven cavity can befitted directly onto a flip-chip or wafer scale bonder and, as such, will allow for the bonding of devices through localised heating thus reducing the risk to thermally sensitive devices. © 2006 IEEE.

AB - A novel open waveguide cavity resonator for the combined variable frequency microwave (VFM) curing of bumps, underfills and encapsulants, as well as the alignment of devices for fast flip-chip assembly, direct chip attach (DCA) or wafer-scale level packaging (WSLP) is presented. This invention achieves radio frequency (RF) curing of adhesives used in microelectronics, optoelectronics and medical devices with potential simultaneous micron-scale alignment accuracy and bonding of devices using VFM technology. The open oven cavity can befitted directly onto a flip-chip or wafer scale bonder and, as such, will allow for the bonding of devices through localised heating thus reducing the risk to thermally sensitive devices. © 2006 IEEE.

UR - http://www.scopus.com/inward/record.url?scp=42549091954&partnerID=8YFLogxK

U2 - 10.1109/ESTC.2006.280155

DO - 10.1109/ESTC.2006.280155

M3 - Conference contribution

SN - 1424405521

SN - 9781424405527

VL - 2

SP - 1149

EP - 1157

BT - ESTC 2006 - 1st Electronics Systemintegration Technology Conference

T2 - ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Y2 - 5 September 2006 through 7 September 2006

ER -

A novel RF-curing technology for microelectronics and optoelectronics packaging

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